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TMS320C6727ZDHA250

Texas Instruments

TMS320C6727ZDHA250 by Texas Instruments

TMS320C6727ZDHA250 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 25 MHz clock frequency, and 1.2-3.3 V power supplies. Ideal for digital signal processing applications due to its floating-point format, boundary scan capability, and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,030 parts In-Stock

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Digiode

USA . 1,696 parts In-Stock

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1,696

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Distributors (Availability)

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AZTECH Wire

Italy . 739 parts In-Stock

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$9.486

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739

$9.486

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Corohmni

South Africa . 27 parts In-Stock

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$17.681

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One Stop Electronics

USA . 845 parts In-Stock

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$32.000

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$32.000

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Parana Technologies

USA . 1,551 parts In-Stock

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$45.628

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$4,237.218

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$41.065

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1,551

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$4,237.218

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DigiPath Technology Company

USA . 333 parts In-Stock

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$50.242

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$46.222

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333

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IDEA Electronic Components Group

UK . 1,698 parts In-Stock

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$51.267

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$48.704

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$46.140

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1,698

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ChromeModa Solutions

Germany . 867 parts In-Stock

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$51.267

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$42.039

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Component Stockers USA

USA . 770 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Unlock the power of digital signal processing with the TMS320C6727ZDHA250 by Texas Instruments. Known for their quality and expertise in semiconductor manufacturing, Texas Instruments delivers a top-of-the-line DSP that is perfect for a wide range of applications. This versatile chip offers unparalleled performance and efficiency, making it ideal for audio processing, telecommunications, and industrial control systems. Experience the value and benefits of cutting-edge technology with the TMS320C6727ZDHA250 - the ultimate solution for your signal processing needs. Choose Texas Instruments for reliability and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.32 V

Allows for efficient power consumption and prevents potential damage from higher voltage inputs.

Address Bus Width: 32

Allows for efficient memory address handling and access, improving overall performance of the DSP.

Package Shape: SQUARE

Optimal shape for fitting onto circuit boards and minimizing wasted space in the design.

Bit Size: 32

Provides high processing power and accuracy for complex signal processing tasks.

Power Supplies (V): 1.2,3.3

Offers flexibility in power options for different system requirements and compatibility with various power sources.

No. of Terminals: 256

Provides ample connectivity options for interfacing with other components and peripherals in the system.

Package Style (Meter): GRID ARRAY

Enhances electrical performance and reliability of the connections, improving overall product quality.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at lower voltage inputs, allowing for versatility in power supply options.

Terminal Position: BOTTOM

Facilitates easy placement on circuit boards and ensures stable connections with other components.

Maximum Seated Height: 2.02 mm

Compact design allows for efficient use of space and integration into various electronic devices.

RAM Words: 262144

Large memory capacity for storing and processing data, enabling complex signal processing tasks.

Width: 17 mm

Compact size allows for easy integration into a variety of electronic devices and systems.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during production and maintenance processes.

External Data Bus Width: 32

Efficient data transfer capabilities for handling large amounts of data quickly and accurately.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing of signals and data, improving overall system performance.

Internal Bus Architecture: MULTIPLE

Optimized internal bus structure for efficient data transfer and processing within the DSP.

Length: 17 mm

Compact size allows for easy integration into a variety of electronic devices and systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral capability for interfacing with different types of devices and systems.

Technology: CMOS

Energy-efficient technology for low power consumption and extended battery life in portable devices.

Terminal Form: BALL

Ball terminals provide secure connections and easy soldering during installation onto circuit boards.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent and reliable operation of the DSP.

Terminal Pitch: 1 mm

Compact terminal pitch allows for high-density mounting on circuit boards, saving space in the design.

Format: FLOATING POINT

Supports floating-point calculations for increased precision and accuracy in signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727ZDHA250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Low Power Mode:

NO

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727ZDHA250 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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