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TMS320C6711DGDP200

Texas Instruments

TMS320C6711DGDP200 by Texas Instruments

TMS320C6711DGDP200 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 200 MHz. It features 16 DMA channels and 17408 RAM words, suitable for digital signal processing applications requiring high clock frequency and low power mode. The package style is grid array with a square shape, making it ideal for surface mount assembly in compact designs.

Median Price

$26.340

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,963 parts In-Stock

1+ parts

$24.231

100+ parts

$21.538

1k+ parts

$15.837

10k+ parts

-

1,963

$24.231

$21.538

$15.837

-

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$37.630

100+ parts

$27.310

1k+ parts

$25.160

10k+ parts

-

1

$37.630

$27.310

$25.160

-

Rochester

USA . 235 parts In-Stock

1+ parts

-

100+ parts

$22.760

1k+ parts

$20.370

10k+ parts

$19.170

235

-

$22.760

$20.370

$19.170

DigiKey

USA . 235 parts In-Stock

1+ parts

-

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235

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-

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Verical

USA . 102 parts In-Stock

1+ parts

-

100+ parts

$28.450

1k+ parts

$25.462

10k+ parts

$23.962

102

-

$28.450

$25.462

$23.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,896 parts In-Stock

1+ parts

$20.900

100+ parts

-

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-

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1,896

$20.900

-

-

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Vyrian

USA . 5,024 parts In-Stock

1+ parts

-

100+ parts

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5,024

-

-

-

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ComSIT Distribution GmbH

Germany . 123 parts In-Stock

1+ parts

-

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123

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Connector Distribution Corp

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

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2

-

-

-

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Right Parts Inc.

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

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2

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 897 parts In-Stock

1+ parts

$16.117

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$16.117

-

-

-

Corphita

USA . 3,887 parts In-Stock

1+ parts

$19.800

100+ parts

-

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3,887

$19.800

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Microchip USA

USA . 2,267 parts In-Stock

1+ parts

$52.620

100+ parts

$51.710

1k+ parts

$51.250

10k+ parts

$50.790

2,267

$52.620

$51.710

$51.250

$50.790

Parana Technologies

USA . 763 parts In-Stock

1+ parts

$67.228

100+ parts

-

1k+ parts

-

10k+ parts

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763

$67.228

-

-

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DigiPath Technology Company

USA . 1,604 parts In-Stock

1+ parts

$74.026

100+ parts

$68.104

1k+ parts

-

10k+ parts

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1,604

$74.026

$68.104

-

-

ChromeModa Solutions

Germany . 1,594 parts In-Stock

1+ parts

$75.537

100+ parts

$61.940

1k+ parts

-

10k+ parts

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1,594

$75.537

$61.940

-

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IDEA Electronic Components Group

UK . 401 parts In-Stock

1+ parts

$75.537

100+ parts

$71.760

1k+ parts

$67.983

10k+ parts

-

401

$75.537

$71.760

$67.983

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Perfect Parts

USA . 113 parts In-Stock

1+ parts

-

100+ parts

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113

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Overview

Elevate your digital signal processing capabilities with the TMS320C6711DGDP200 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance in the category of Digital Signal Processors (DSPs). This powerful processor offers integrated cache, multiple power supplies, and a peak clock frequency of 200 MHz. From audio processing to telecommunications, this product provides value and benefits across a wide range of applications. Upgrade your technology today with the TMS320C6711DGDP200 and experience the advantages of cutting-edge innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to potential damage.

Integrated Cache: YES

Having an integrated cache allows for quicker access to frequently used data, improving overall performance and efficiency.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage provides flexibility in power options and supports various applications.

Address Bus Width: 22

A wider address bus allows for accessing a larger memory space, enabling complex data processing and storage capabilities.

Package Shape: SQUARE

The square shape of the package makes it easier to mount and align on circuit boards, enhancing the overall design and functionality.

Bit Size: 32

With a 32-bit architecture, the product can handle larger chunks of data at once, increasing processing speed and performance.

Power Supplies (V): 1.2, 3.3

Having multiple power supply options allows for compatibility with different voltage systems, enhancing the product's versatility.

No. of Terminals: 272

A higher number of terminals provide increased connectivity options and support for various input/output configurations.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and reliability, ensuring stable operation under different conditions.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for efficient power management and energy-saving features, contributing to lower operational costs.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can withstand intense use and harsh environments without degrading performance.

No. of External Interrupts: 4

Having multiple external interrupts helps in managing and prioritizing tasks, ensuring smooth operation and responsiveness to external events.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation even in cold environments, expanding the product's usability range.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and conductivity, ensuring secure connections for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy integration and space-saving design, making installation and maintenance hassle-free.

Maximum Seated Height: 2.57 mm

The low maximum seated height allows for compact and streamlined product designs, saving space and optimizing PCB layout.

RAM Words: 17408

The large RAM capacity enables efficient data storage and processing, supporting multitasking and complex algorithm execution.

Width: 27 mm

The moderate width of the product allows for easy integration into various systems and devices without compromising performance.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging, ensuring quality control and reliability in the product's operation.

External Data Bus Width: 32

The wider external data bus width allows for faster data transfer and processing, enhancing overall system speed and efficiency.

Maximum Clock Frequency: 200 MHz

With a high maximum clock frequency, the product can handle rapid data processing and real-time operations, meeting demanding performance requirements.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures secure solder joints and reliable connections during manufacturing and assembly processes.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data routing and communication within the processor, enhancing overall speed and performance.

Length: 27 mm

The moderate length of the product enables easy fitting and compatibility with standard board sizes, ensuring seamless integration in different systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Comprehensive peripheral IC type support expands the product's compatibility and functionality across various digital signal processing applications.

No. of Timers: 2

Having multiple timers allows for precise timekeeping and event scheduling, enhancing the product's versatility and performance in time-critical tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form provides reliable connectivity and easy soldering, ensuring secure connections for stable operation and durability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage offers stable and efficient power delivery, supporting consistent performance and reliability throughout operation.

No. of DMA Channels: 16

Having multiple DMA channels allows for efficient data transfer and management, enhancing overall system performance and responsiveness.

ROM Programmability: FLASH

ROM programmability with flash memory enables quick and easy firmware updates, supporting customization and adaptability to changing requirements.

Terminal Pitch: 1.27 mm

The standard terminal pitch facilitates easy PCB layout and assembly, ensuring compatibility with common industry standards and practices.

Format: FLOATING POINT

The floating-point format allows for precise numerical calculations and complex mathematical operations, expanding the product's capabilities in signal processing tasks.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the product can withstand typical environmental conditions and manufacturing processes without degradation.

Low Power Mode: YES

The low power mode feature provides energy-saving options for prolonged battery life and efficient power management, making the product ideal for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6711DGDP200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

17408

ROM Programmability:

FLASH

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6711DGDP200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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