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TMS320C6678CYPA

Texas Instruments

TMS320C6678CYPA by Texas Instruments

TMS320C6678CYPA by Texas Instruments is a 32-bit DSP with 841 terminals, operating at max 312.5 MHz clock frequency. Ideal for industrial applications, it features a 24mm square package and supports floating-point format for efficient processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,986 parts In-Stock

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Digiode

USA . 2,159 parts In-Stock

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2,159

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$13.381

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786

$13.381

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One Stop Electronics

USA . 1,489 parts In-Stock

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$26.000

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1,489

$26.000

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Corohmni

South Africa . 2,174 parts In-Stock

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$39.214

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$39.214

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Parana Technologies

USA . 467 parts In-Stock

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$75.906

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467

$75.906

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DigiPath Technology Company

USA . 1,866 parts In-Stock

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$83.582

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$76.896

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1,866

$83.582

$76.896

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ChromeModa Solutions

Germany . 6,437 parts In-Stock

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$85.288

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$69.936

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$69.936

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IDEA Electronic Components Group

UK . 710 parts In-Stock

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$85.288

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$81.024

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$76.759

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710

$85.288

$81.024

$76.759

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Component Stockers USA

USA . 269 parts In-Stock

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$99.990

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Corphita

USA . 2,668 parts In-Stock

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Microchip USA

USA . 1,277 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the TMS320C6678CYPA from Texas Instruments. This cutting-edge DSP offers unparalleled performance and reliability in a compact package, making it ideal for a wide range of applications. Whether you're designing complex audio systems, high-speed communications networks, or industrial automation solutions, this processor delivers the speed, efficiency, and flexibility you need to stay ahead of the competition. Trust Texas Instruments to provide quality products that meet your needs and exceed your expectations. Elevate your projects to the next level with the TMS320C6678CYPA - the smart choice for savvy engineers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for use in various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in the production process.

Maximum Supply Voltage: 1.05 V

Operating at a low maximum supply voltage of 1.05V ensures energy efficiency and can contribute to extending the product's lifespan.

Address Bus Width: 24

With a wide address bus width of 24, the DSP can efficiently handle and process large amounts of data, suitable for complex signal processing tasks.

Bit Size: 32

A larger bit size of 32 allows for higher precision in calculations and signal processing, resulting in more accurate and reliable performance.

Power Supplies (V): 1,1.5,1.8

Having multiple power supply options (1V, 1.5V, 1.8V) provides flexibility in system design and power optimization based on specific requirements.

No. of Terminals: 841

The high number of terminals allows for connectivity to a wide range of external components and peripherals, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensures secure mounting on the PCB, improving reliability and signal integrity in the overall system.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum supply voltage of 0.95V ensures power efficiency and can help minimize energy consumption in the system.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, the DSP can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -40 °C

Operating efficiently even at low temperatures down to -40°C makes this product suitable for a wide range of industrial and automotive applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier mounting and connections on the PCB, enhancing the ease of assembly and maintenance.

Maximum Seated Height: 3.39 mm

With a low maximum seated height of 3.39mm, the DSP takes up minimal space on the PCB, allowing for compact and efficient designs.

RAM Words: 8192

The large RAM capacity of 8192 words enables efficient storage and retrieval of data during processing, enabling smooth operation in complex applications.

Width: 24 mm

Compact width of 24mm allows for easy integration into various system designs, maximizing space utilization and flexibility.

Boundary Scan: YES

Having boundary scan capability simplifies testing and debugging processes during production, ensuring high product quality and reliability.

External Data Bus Width: 16

With an external data bus width of 16, the DSP can efficiently interface with external devices and peripherals, enhancing connectivity and data transfer speeds.

Maximum Clock Frequency: 312.5 MHz

High maximum clock frequency of 312.5 MHz enables fast and efficient signal processing, supporting real-time applications with low latency.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing capabilities, enabling parallel processing and optimized performance for complex tasks.

Length: 24 mm

Compact length of 24mm allows for efficient use of board space and facilitates compact system designs without compromising functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments, making the product suitable for industrial applications with stringent requirements.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With advanced digital signal processing capabilities and additional peripheral support, the product offers a versatile solution for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed, and compatibility with various system configurations, enhancing overall performance and efficiency.

Terminal Form: BALL

Ball terminal form simplifies soldering and mounting processes, ensuring secure connections and reliable performance in the system.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage of 1V ensures consistent performance and reduces the risk of voltage fluctuations affecting the operation of the DSP.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm allows for high-density mounting on the PCB, saving space and enabling compact system designs with efficient signal routing.

Format: FLOATING POINT

Using floating-point format enhances numerical accuracy and precision in calculations, making the product suitable for applications requiring high computational accuracy.

Low Power Mode: YES

Support for low power mode enables energy-efficient operation, prolonging battery life and reducing overall power consumption in portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678CYPA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

312.5 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

841

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678CYPA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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