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TMS320C6678CYP25

Texas Instruments

TMS320C6678CYP25 by Texas Instruments

TMS320C6678CYP25 by Texas Instruments is a 32-bit DSP with 312.5 MHz clock frequency, 8192 RAM words, and 841 terminals. It operates b/w 0-85°C and has low power mode for energy efficiency. Ideal for digital signal processing applications requiring high-speed data processing in compact form factors.

Median Price

$244.980

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9 parts In-Stock

1+ parts

$244.980

100+ parts

$240.100

1k+ parts

$235.200

10k+ parts

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9

$244.980

$240.100

$235.200

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Distributors (In-Stock)

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Vyrian

USA . 5,993 parts In-Stock

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5,993

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Digiode

USA . 540 parts In-Stock

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540

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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One Stop Electronics

USA . 767 parts In-Stock

1+ parts

$7.000

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767

$7.000

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AZTECH Wire

Italy . 727 parts In-Stock

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$14.767

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727

$14.767

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Parana Technologies

USA . 1,960 parts In-Stock

1+ parts

$15.009

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$15.429

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1,960

$15.009

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$15.429

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ChromeModa Solutions

Germany . 6,264 parts In-Stock

1+ parts

$16.864

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$13.828

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6,264

$16.864

$13.828

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IDEA Electronic Components Group

UK . 1,165 parts In-Stock

1+ parts

$16.864

100+ parts

$16.021

1k+ parts

$15.178

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1,165

$16.864

$16.021

$15.178

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Corohmni

South Africa . 650 parts In-Stock

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$70.274

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650

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Microchip USA

USA . 1,766 parts In-Stock

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1,766

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DigiPath Technology Company

USA . 1,056 parts In-Stock

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$15.205

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1,056

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$15.205

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Corphita

USA . 111 parts In-Stock

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Perfect Parts

USA . 25 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 11 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320C6678CYP25 by Texas Instruments. This high-quality Digital Signal Processor offers unparalleled performance and versatility, making it ideal for a wide range of applications. With its advanced features and innovative design, this product delivers exceptional value, benefits, and advantages to customers seeking top-of-the-line processing capabilities. Trust Texas Instruments for superior quality and reliability in the world of DSPs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product more affordable and long-lasting.

Surface Mount: YES

Surface mount technology makes installation easier and more efficient.

Maximum Supply Voltage: 1.05 V

Operates efficiently at a relatively low voltage, reducing power consumption.

Address Bus Width: 24

Allows for a larger address space, facilitating complex signal processing tasks.

Package Shape: SQUARE

Square package shape makes it easier to mount and integrate into circuit designs.

Bit Size: 32

32-bit architecture enables high-speed processing of digital signals.

Power Supplies (V): 1, 1.5, 1.8

Supports a range of power supply voltages, increasing versatility in different applications.

No. of Terminals: 841

Large number of terminals allow for connection to various peripherals and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch design improve signal integrity and reduce crosstalk.

Minimum Supply Voltage: 0.95 V

Can operate at a very low voltage, ideal for low-power applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: 0 °C

Operates reliably even at low temperatures, making it suitable for various conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing.

Maximum Seated Height: 3.39 mm

Low seated height allows for compact device designs.

RAM Words: 8192

Large RAM capacity enables storage and processing of data efficiently.

Width: 24 mm

Compact width makes it easy to integrate into tight spaces.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging during production.

External Data Bus Width: 16

16-bit external data bus width facilitates high-speed data transfer.

Maximum Clock Frequency: 312.5 MHz

High clock frequency enables fast processing of digital signals.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel processing, improving performance.

Length: 24 mm

Compact length makes it suitable for small form factor devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripherals for signal processing tasks ensure efficient operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes.

Nominal Supply Voltage: 1 V

Stable supply voltage ensures reliable operation of the DSP.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting on PCBs.

Format: FLOATING POINT

Supports floating-point operations for accurate signal processing.

Low Power Mode: YES

Low power mode helps reduce energy consumption during idle or low processing load periods.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678CYP25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

312.5 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

841

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678CYP25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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