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TMS320C6678AXCYPA

Texas Instruments

TMS320C6678AXCYPA by Texas Instruments

TMS320C6678AXCYPA by Texas Instruments is a 32-bit DSP with integrated cache, 16-bit external data bus width, and 80 DMA channels. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode support.

Median Price

$279.905

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 96 parts In-Stock

1+ parts

$279.905

100+ parts

$253.362

1k+ parts

$241.297

10k+ parts

-

96

$279.905

$253.362

$241.297

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,976 parts In-Stock

1+ parts

$265.910

100+ parts

-

1k+ parts

-

10k+ parts

-

3,976

$265.910

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$282.413

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$282.413

-

-

-

Vyrian

USA . 3,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,232

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$17.517

100+ parts

-

1k+ parts

-

10k+ parts

-

857

$17.517

-

-

-

Parana Technologies

USA . 873 parts In-Stock

1+ parts

$26.876

100+ parts

-

1k+ parts

$29.570

10k+ parts

-

873

$26.876

-

$29.570

-

DigiPath Technology Company

USA . 272 parts In-Stock

1+ parts

$29.594

100+ parts

$27.227

1k+ parts

-

10k+ parts

-

272

$29.594

$27.227

-

-

ChromeModa Solutions

Germany . 2,550 parts In-Stock

1+ parts

$30.198

100+ parts

$24.762

1k+ parts

-

10k+ parts

-

2,550

$30.198

$24.762

-

-

IDEA Electronic Components Group

UK . 322 parts In-Stock

1+ parts

$30.198

100+ parts

$28.688

1k+ parts

$27.178

10k+ parts

-

322

$30.198

$28.688

$27.178

-

Corohmni

South Africa . 5,011 parts In-Stock

1+ parts

$83.898

100+ parts

-

1k+ parts

-

10k+ parts

-

5,011

$83.898

-

-

-

Ampacity Inc.

Singapore . 96 parts In-Stock

1+ parts

$237.920

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$237.920

-

-

-

Corphita

USA . 3,451 parts In-Stock

1+ parts

$251.914

100+ parts

-

1k+ parts

-

10k+ parts

-

3,451

$251.914

-

-

-

Microchip USA

USA . 1,996 parts In-Stock

1+ parts

$275.660

100+ parts

$268.310

1k+ parts

$264.630

10k+ parts

$260.960

1,996

$275.660

$268.310

$264.630

$260.960

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$276.765

100+ parts

-

1k+ parts

$265.694

10k+ parts

-

2,000

$276.765

-

$265.694

-

Continental Prestige Electronics

USA . 2,055 parts In-Stock

1+ parts

$282.413

100+ parts

-

1k+ parts

-

10k+ parts

$276.765

2,055

$282.413

-

-

$276.765

Argo Parts USA

USA . 779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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779

-

-

-

-

Overview

Experience the power of cutting-edge technology with the TMS320C6678AXCYPA by Texas Instruments, a leading manufacturer in the industry. This digital signal processor offers unmatched performance and reliability, making it ideal for a wide range of applications. From telecommunications to industrial automation, this DSP delivers exceptional value, efficiency, and versatility to meet the diverse needs of customers. Elevate your projects to the next level with the TMS320C6678AXCYPA and experience seamless integration and high-speed processing like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the DSP, making it suitable for various environmental conditions.

Integrated Cache: YES

The integrated cache helps in increasing the processing speed and efficiency of the DSP, making it ideal for tasks that require quick data access.

Bit Size: 32

A 32-bit architecture allows for processing larger chunks of data at a time, enhancing the overall performance of the DSP.

Power Supplies (V): 1, 1.5, 1.8

Having multiple power supply options provides flexibility in different applications and ensures compatibility with various power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this DSP can function reliably in demanding industrial environments without overheating.

RAM Words: 8192

The large RAM capacity allows for efficient storage and retrieval of data, enabling smooth and uninterrupted operation of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a specialized digital signal processor, this product is designed to handle complex signal processing tasks efficiently and accurately.

Technology: CMOS

CMOS technology ensures low power consumption and high integration levels, making the DSP energy-efficient and suitable for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678AXCYPA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678AXCYPA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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