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TMS320C6654CZH8

Texas Instruments

TMS320C6654CZH8 by Texas Instruments

TMS320C6654CZH8 by Texas Instruments is a 32-bit DSP with integrated cache and 8192 RAM words. It features 64 DMA channels, 16 timers, and operates at temperatures from 0 to 85°C. Ideal for digital signal processing applications requiring low power mode and floating-point format.

Median Price

$76.970

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 220 parts In-Stock

1+ parts

$54.239

100+ parts

$48.212

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$35.450

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220

$54.239

$48.212

$35.450

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Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$76.970

100+ parts

$56.780

1k+ parts

$56.690

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50

$76.970

$56.780

$56.690

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DigiKey

USA . 60 parts In-Stock

1+ parts

$77.020

100+ parts

$58.371

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60

$77.020

$58.371

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Distributors (In-Stock)

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Digiode

USA . 3,189 parts In-Stock

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$51.414

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Vyrian

USA . 2,316 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Chip Stock

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 308 parts In-Stock

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$16.890

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$16.890

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Corohmni

South Africa . 261 parts In-Stock

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$24.360

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Ampacity Inc.

Singapore . 110 parts In-Stock

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$46.000

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Corphita

USA . 4,392 parts In-Stock

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$48.708

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Parana Technologies

USA . 730 parts In-Stock

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$54.198

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730

$54.198

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ChromeModa Solutions

Germany . 2,453 parts In-Stock

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$60.897

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$49.936

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2,453

$60.897

$49.936

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IDEA Electronic Components Group

UK . 775 parts In-Stock

1+ parts

$60.897

100+ parts

$57.852

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$54.807

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775

$60.897

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$54.807

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Lixinc

USA . 9,418 parts In-Stock

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Continental Prestige Electronics

USA . 5,596 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 1,749 parts In-Stock

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$54.905

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Perfect Parts

USA . 1,478 parts In-Stock

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Argo Parts USA

USA . 1,470 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320C6654CZH8 by Texas Instruments. As a leader in digital signal processors, Texas Instruments guarantees top-notch quality and reliability. This versatile DSP offers a wide range of applications, providing unparalleled performance and efficiency. Experience seamless integration and exceptional value with this innovative product. Elevate your projects to new heights with the TMS320C6654CZH8 and witness the difference it can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated components.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data.

Surface Mount: YES

Allows for easy and compact installation on circuit boards.

Bit Size: 32

High bit size allows for complex calculations and processing tasks.

Power Supplies (V): 1,1.5,1.8

Offers flexibility in power requirements for different applications.

No. of Terminals: 625

Provides ample connectivity options for various input and output devices.

Maximum Operating Temperature: 85 °C

Can operate efficiently in a wide range of temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for digital signal processing tasks, making it a reliable choice for signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

No. of DMA Channels: 64

Plenty of direct memory access channels for efficient data transfer and processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6654CZH8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

625

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6654CZH8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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