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TMS320C6474FCUNA

Texas Instruments

TMS320C6474FCUNA by Texas Instruments

TMS320C6474FCUNA by Texas Instruments is a DSP with 32-bit external data bus, 14-bit address bus, and 64 DMA channels. Ideal for industrial applications, it features integrated cache memory, operates b/w -40 to 100°C, and has a peak reflow temperature of 245°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,218 parts In-Stock

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Vyrian

USA . 2,150 parts In-Stock

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2,150

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Distributors (Availability)

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AZTECH Wire

Italy . 636 parts In-Stock

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$5.270

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636

$5.270

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Ampacity Inc.

Singapore . 1,369 parts In-Stock

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$12.000

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1,369

$12.000

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One Stop Electronics

USA . 427 parts In-Stock

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$33.000

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427

$33.000

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Parana Technologies

USA . 1,830 parts In-Stock

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$45.583

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$45.583

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DigiPath Technology Company

USA . 933 parts In-Stock

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$50.193

100+ parts

$46.177

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933

$50.193

$46.177

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ChromeModa Solutions

Germany . 5,093 parts In-Stock

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$51.217

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$41.998

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5,093

$51.217

$41.998

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IDEA Electronic Components Group

UK . 770 parts In-Stock

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$51.217

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$48.656

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$46.095

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770

$51.217

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$46.095

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Microchip USA

USA . 1,564 parts In-Stock

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$255.690

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$248.870

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$245.460

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$242.050

1,564

$255.690

$248.870

$245.460

$242.050

Corohmni

South Africa . 5,193 parts In-Stock

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$286.485

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5,193

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Corphita

USA . 4,848 parts In-Stock

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Component Stockers USA

USA . 10 parts In-Stock

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10

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Overview

Unlock the power of cutting-edge technology with the TMS320C6474FCUNA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This digital signal processor is perfect for a wide range of applications, offering unparalleled performance and efficiency. Experience seamless integration and smooth operation with this versatile DSP. Elevate your projects with the value and benefits that only the TMS320C6474FCUNA can provide. Trust in Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and provides protection to the DSP, making it suitable for various environments.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of the DSP by storing frequently accessed data.

Surface Mount: YES

Surface mount feature allows for easy installation and compact design, making it ideal for space-constrained applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability and performance in harsh operating conditions.

No. of Terminals: 561

Higher number of terminals provide connectivity options and versatility in system integration.

Technology: CMOS

CMOS technology offers low power consumption and high speed processing capabilities, making the DSP energy efficient and fast.

No. of DMA Channels: 64

Having 64 DMA channels allows for efficient data transfer and processing, enhancing the overall performance of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6474FCUNA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

0.9-1.2V CORE NOMINAL VALUE AVAILABLE

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B561

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

561

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

ROM Programmability:

MROM

Maximum Seated Height:

3.3 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6474FCUNA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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