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TMS320C6474FCUN8

Texas Instruments

TMS320C6474FCUN8 by Texas Instruments

TMS320C6474FCUN8 by Texas Instruments is a DSP with 32-bit external data bus, 14-bit address bus, and 64 DMA channels. It is used in digital signal processing applications requiring low power mode and fixed-point format for efficient processing.

Median Price

$176.018

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 334 parts In-Stock

1+ parts

$176.018

100+ parts

$159.327

1k+ parts

$151.740

10k+ parts

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334

$176.018

$159.327

$151.740

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,095 parts In-Stock

1+ parts

$167.217

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-

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3,095

$167.217

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Vyrian

USA . 2,810 parts In-Stock

1+ parts

-

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2,810

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$21.290

100+ parts

-

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157

$21.290

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Parana Technologies

USA . 368 parts In-Stock

1+ parts

$54.232

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-

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368

$54.232

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DigiPath Technology Company

USA . 501 parts In-Stock

1+ parts

$59.716

100+ parts

$54.939

1k+ parts

-

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501

$59.716

$54.939

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ChromeModa Solutions

Germany . 2,560 parts In-Stock

1+ parts

$60.935

100+ parts

$49.967

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-

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2,560

$60.935

$49.967

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IDEA Electronic Components Group

UK . 281 parts In-Stock

1+ parts

$60.935

100+ parts

$57.888

1k+ parts

$54.842

10k+ parts

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281

$60.935

$57.888

$54.842

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Corphita

USA . 2,371 parts In-Stock

1+ parts

$158.416

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-

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2,371

$158.416

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Corohmni

South Africa . 3,226 parts In-Stock

1+ parts

$242.784

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3,226

$242.784

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Microchip USA

USA . 1,741 parts In-Stock

1+ parts

$318.654

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1,741

$318.654

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Overview

Experience unparalleled performance and reliability with the TMS320C6474FCUN8 by Texas Instruments. As a leader in the industry, Texas Instruments has developed this Digital Signal Processor (DSP) to exceed your expectations. Whether you are working on audio processing, telecommunications, or industrial automation, this product delivers superior results. With integrated cache, boundary scan capabilities, low power mode, and a wide range of features, the TMS320C6474FCUN8 offers exceptional value and benefits to customers. Trust Texas Instruments for cutting-edge technology that brings your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during handling and transportation.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, allowing for quicker data retrieval and processing.

Surface Mount: YES

Surface mount technology enables easy assembly onto circuit boards, saving space and reducing production costs.

Address Bus Width: 14

With a wider address bus, the DSP can access and process larger amounts of data simultaneously, enhancing its performance capabilities.

Package Style: GRID ARRAY, FINE PITCH

The grid array with fine pitch design allows for high-density mounting of components, resulting in a compact and efficient product layout.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the DSP can function reliably in various operating environments without overheating or performance issues.

Technology: CMOS

CMOS technology offers low power consumption, which is beneficial for energy-efficient operation and longer battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6474FCUN8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

0.9-1.2V CORE NOMINAL VALUE AVAILABLE

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B561

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

561

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

ROM Programmability:

MROM

Maximum Seated Height:

3.3 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6474FCUN8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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