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TMS320C6454BGTZA

Texas Instruments

TMS320C6454BGTZA by Texas Instruments

TMS320C6454BGTZA by Texas Instruments is a 32-bit DSP with 64 DMA channels, 66.6 MHz clock frequency, and 32768 RAM words. Ideal for industrial applications requiring high-speed data processing and fixed-point calculations in a compact package with boundary scan support.

Median Price

$257.670

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 401 parts In-Stock

1+ parts

$229.089

100+ parts

$222.199

1k+ parts

$172.247

10k+ parts

-

401

$229.089

$222.199

$172.247

-

Rochester

USA . 451 parts In-Stock

1+ parts

$236.940

100+ parts

$222.720

1k+ parts

$208.510

10k+ parts

-

451

$236.940

$222.720

$208.510

-

DigiKey

USA . 451 parts In-Stock

1+ parts

$296.180

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$296.180

-

-

-

Verical

USA . 239 parts In-Stock

1+ parts

-

100+ parts

$278.400

1k+ parts

$260.637

10k+ parts

-

239

-

$278.400

$260.637

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,915 parts In-Stock

1+ parts

$217.635

100+ parts

-

1k+ parts

-

10k+ parts

-

3,915

$217.635

-

-

-

Vyrian

USA . 7,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,540

-

-

-

-

TME

Poland . 88 parts In-Stock

1+ parts

-

100+ parts

$295.142

1k+ parts

-

10k+ parts

-

88

-

$295.142

-

-

Bristol Electronics

USA . 39 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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39

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 9 parts In-Stock

1+ parts

$27.807

100+ parts

-

1k+ parts

$40.233

10k+ parts

-

9

$27.807

-

$40.233

-

ChromeModa Solutions

Germany . 1,279 parts In-Stock

1+ parts

$31.244

100+ parts

$25.620

1k+ parts

-

10k+ parts

-

1,279

$31.244

$25.620

-

-

IDEA Electronic Components Group

UK . 1,044 parts In-Stock

1+ parts

$31.244

100+ parts

$29.682

1k+ parts

$28.120

10k+ parts

-

1,044

$31.244

$29.682

$28.120

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Corphita

USA . 4,964 parts In-Stock

1+ parts

$206.180

100+ parts

-

1k+ parts

-

10k+ parts

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4,964

$206.180

-

-

-

Corohmni

South Africa . 652 parts In-Stock

1+ parts

$232.670

100+ parts

-

1k+ parts

-

10k+ parts

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652

$232.670

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-

-

Microchip USA

USA . 2,832 parts In-Stock

1+ parts

$253.800

100+ parts

$247.030

1k+ parts

$243.640

10k+ parts

$240.260

2,832

$253.800

$247.030

$243.640

$240.260

DigiPath Technology Company

USA . 882 parts In-Stock

1+ parts

-

100+ parts

$28.170

1k+ parts

-

10k+ parts

-

882

-

$28.170

-

-

Overview

Experience unparalleled performance and efficiency with the TMS320C6454BGTZA by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line digital signal processor, this product offers seamless integration, advanced features, and exceptional reliability for a wide range of applications. From telecommunications to industrial automation, this powerhouse delivers unmatched value, benefits, and advantages to customers seeking cutting-edge technology. Trust in Texas Instruments to provide you with the quality and innovation you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 20

With a wide address bus width of 20, the DSP can efficiently handle large amounts of memory addresses.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities and precision.

No. of Terminals: 697

The high number of terminals allows for versatile connectivity options with other components.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the DSP suitable for industrial applications with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific peripheral IC type indicates that the DSP is designed for digital signal processing tasks, ensuring optimal performance in signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6454BGTZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

697

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6454BGTZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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