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TMS320C6452ZUT9

Texas Instruments

TMS320C6452ZUT9 by Texas Instruments

TMS320C6452ZUT9 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 66 MHz. It has 32768 RAM words and supports boundary scan. Ideal for digital signal processing applications requiring low power consumption and high-speed data processing capabilities.

Median Price

$134.065

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12 parts In-Stock

1+ parts

$123.280

100+ parts

$115.880

1k+ parts

$108.490

10k+ parts

-

12

$123.280

$115.880

$108.490

-

Verical

USA . 12 parts In-Stock

1+ parts

-

100+ parts

$144.850

1k+ parts

$135.613

10k+ parts

-

12

-

$144.850

$135.613

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,611 parts In-Stock

1+ parts

$135.974

100+ parts

-

1k+ parts

-

10k+ parts

-

4,611

$135.974

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-

-

DigiKey Marketplace

USA . 79 parts In-Stock

1+ parts

$148.860

100+ parts

-

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-

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79

$148.860

-

-

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Vyrian

USA . 5,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,795

-

-

-

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Zilex Electronics Inc.

Canada . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

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-

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Lantek

USA . 84 parts In-Stock

1+ parts

-

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84

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,607 parts In-Stock

1+ parts

$75.625

100+ parts

-

1k+ parts

-

10k+ parts

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1,607

$75.625

-

-

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DigiPath Technology Company

USA . 307 parts In-Stock

1+ parts

$83.273

100+ parts

-

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-

10k+ parts

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307

$83.273

-

-

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ChromeModa Solutions

Germany . 6,484 parts In-Stock

1+ parts

$84.972

100+ parts

$69.677

1k+ parts

-

10k+ parts

-

6,484

$84.972

$69.677

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IDEA Electronic Components Group

UK . 383 parts In-Stock

1+ parts

$84.972

100+ parts

$80.723

1k+ parts

$76.475

10k+ parts

-

383

$84.972

$80.723

$76.475

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Corohmni

South Africa . 935 parts In-Stock

1+ parts

$127.620

100+ parts

-

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935

$127.620

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Corphita

USA . 3,886 parts In-Stock

1+ parts

$128.817

100+ parts

-

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10k+ parts

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3,886

$128.817

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-

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Microchip USA

USA . 167 parts In-Stock

1+ parts

$144.260

100+ parts

$140.410

1k+ parts

$138.490

10k+ parts

$136.570

167

$144.260

$140.410

$138.490

$136.570

Perfect Parts

USA . 847 parts In-Stock

1+ parts

-

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847

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GreenTree Electronics

Israel . 84 parts In-Stock

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84

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Overview

Experience the cutting-edge technology of the TMS320C6452ZUT9 by Texas Instruments, a top-tier manufacturer known for its high-quality digital signal processors. This versatile product is perfect for a wide range of applications in industries such as telecommunications, audio processing, and industrial automation. With integrated cache and a maximum clock frequency of 66 MHz, this DSP offers unparalleled performance and efficiency. Trust Texas Instruments to deliver value, reliability, and innovation with every product they create. Elevate your projects with the TMS320C6452ZUT9 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the DSP, enhancing overall performance.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can function effectively in various environmental conditions.

RAM Words: 32768

Large RAM capacity allows for efficient storage and retrieval of data, enhancing the processing capabilities of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral ICs for digital signal processing tasks ensure optimized performance and functionality.

Maximum Clock Frequency: 66 MHz

High clock frequency enables fast data processing and execution of complex algorithms, making the DSP suitable for high-performance applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making the DSP energy-efficient and effective for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6452ZUT9 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

CAN ALSO REQUIRES WITH 1.8V I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

529

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320C6452ZUT9 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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