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TMS320C6424ZDU6

Texas Instruments

TMS320C6424ZDU6 by Texas Instruments

TMS320C6424ZDU6 by Texas Instruments is a 32-bit DSP with integrated cache, 20480 RAM words, and 64 DMA channels. It operates at a max clock frequency of 30 MHz and is suitable for digital signal processing applications requiring low power consumption. The package style includes grid array and heat sink/slug options.

Median Price

$41.566

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 240 parts In-Stock

1+ parts

$30.210

100+ parts

$29.610

1k+ parts

$29.000

10k+ parts

-

240

$30.210

$29.610

$29.000

-

Texas Instruments

USA . 502 parts In-Stock

1+ parts

$41.566

100+ parts

$36.947

1k+ parts

$27.167

10k+ parts

-

502

$41.566

$36.947

$27.167

-

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$66.390

100+ parts

$52.060

1k+ parts

$48.630

10k+ parts

-

1

$66.390

$52.060

$48.630

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,041 parts In-Stock

1+ parts

$39.488

100+ parts

-

1k+ parts

-

10k+ parts

-

2,041

$39.488

-

-

-

Vyrian

USA . 9,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,214

-

-

-

-

TME

Poland . 120 parts In-Stock

1+ parts

-

100+ parts

$42.210

1k+ parts

-

10k+ parts

-

120

-

$42.210

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 6,542 parts In-Stock

1+ parts

$17.820

100+ parts

-

1k+ parts

-

10k+ parts

-

6,542

$17.820

-

-

-

Corphita

USA . 3,650 parts In-Stock

1+ parts

$37.409

100+ parts

-

1k+ parts

-

10k+ parts

-

3,650

$37.409

-

-

-

Corohmni

South Africa . 3,232 parts In-Stock

1+ parts

$42.900

100+ parts

-

1k+ parts

-

10k+ parts

-

3,232

$42.900

-

-

-

Parana Technologies

USA . 355 parts In-Stock

1+ parts

$60.546

100+ parts

-

1k+ parts

-

10k+ parts

-

355

$60.546

-

-

-

DigiPath Technology Company

USA . 846 parts In-Stock

1+ parts

$66.668

100+ parts

$61.335

1k+ parts

-

10k+ parts

-

846

$66.668

$61.335

-

-

ChromeModa Solutions

Germany . 3,500 parts In-Stock

1+ parts

$68.029

100+ parts

$55.784

1k+ parts

-

10k+ parts

-

3,500

$68.029

$55.784

-

-

IDEA Electronic Components Group

UK . 947 parts In-Stock

1+ parts

$68.029

100+ parts

$64.628

1k+ parts

$61.226

10k+ parts

-

947

$68.029

$64.628

$61.226

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Speed Components Ltd (Excess)

Israel . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9

-

-

-

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Overview

Unleash the power of digital signal processing with the TMS320C6424ZDU6 by Texas Instruments. This cutting-edge DSP offers unparalleled performance and reliability, backed by the trusted name of TI. Ideal for a wide range of applications, this DSP provides seamless integration and maximum efficiency. Elevate your projects with the superior quality and value that only Texas Instruments can deliver. Step up to the TMS320C6424ZDU6 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

Having an integrated cache improves data access speeds and overall performance of the DSP.

Maximum Supply Voltage: 1.26 V

This ensures safe operation within specified voltage limits, increasing reliability.

Address Bus Width: 32

The wide address bus allows for efficient memory addressing and processing of large datasets.

Width: 23 mm

Compact size makes it suitable for space-constrained applications.

Maximum Clock Frequency: 30 MHz

The high clock frequency enables fast signal processing and real-time data handling.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6424ZDU6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6424ZDU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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