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TMS320C6421ZDUQ6

Texas Instruments

TMS320C6421ZDUQ6 by Texas Instruments

TMS320C6421ZDUQ6 by Texas Instruments is a 32-bit DSP with 22-bit address bus, 600 MHz clock frequency, and 12288 RAM words. Ideal for industrial applications requiring high-speed signal processing in a compact package. Features include multiple internal bus architecture, boundary scan support, and low power consumption at supply voltages of 1.2V to 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,279 parts In-Stock

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Digiode

USA . 689 parts In-Stock

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689

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AZTECH Wire

Italy . 297 parts In-Stock

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$13.878

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One Stop Electronics

USA . 525 parts In-Stock

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$23.000

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Parana Technologies

USA . 1,186 parts In-Stock

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$29.407

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$59.039

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DigiPath Technology Company

USA . 1,299 parts In-Stock

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$32.381

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$29.791

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ChromeModa Solutions

Germany . 5,653 parts In-Stock

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$33.042

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$27.094

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$33.042

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IDEA Electronic Components Group

UK . 1,601 parts In-Stock

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$33.042

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$31.390

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$29.738

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1,601

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$29.738

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Corohmni

South Africa . 123 parts In-Stock

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$84.656

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QUARKTWIN TECHNOLOGY LTD

USA . 16,842 parts In-Stock

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Corphita

USA . 1,128 parts In-Stock

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Microchip USA

USA . 262 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320C6421ZDUQ6 by Texas Instruments, a leading manufacturer in digital signal processors. Designed for a wide range of applications, this DSP offers customers exceptional value with its cutting-edge technology and efficient processing capabilities. Take your projects to the next level with the TMS320C6421ZDUQ6 and unlock endless possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.26 V

Allows for optimal performance while ensuring safe operation.

Address Bus Width: 22

Enables efficient memory addressing for faster data processing.

Bit Size: 32

Offers high processing power for complex algorithms and computations.

Power Supplies (V): 1.2,1.8,3.3

Allows compatibility with a variety of power sources for flexibility in usage.

No. of Terminals: 376

Provides ample connectivity options for interfacing with external devices.

Package Style (Meter): GRID ARRAY

Facilitates secure placement on the circuit board and efficient heat dissipation.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

Allows the DSP to function reliably in a wide range of environmental conditions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZDUQ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

LOW-POWER DEVICE

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

600 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

376

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

12288

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZDUQ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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