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TMS320C6421ZDUQ5

Texas Instruments

TMS320C6421ZDUQ5 by Texas Instruments

TMS320C6421ZDUQ5 by Texas Instruments is a 32-bit DSP with 500 MHz clock frequency, 12288 RAM words, and 22-bit address bus width. Ideal for industrial applications requiring high-speed signal processing, it features integrated cache, multiple internal bus architecture, and boundary scan capability.

Median Price

$30.449

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 100 parts In-Stock

1+ parts

$24.038

100+ parts

$20.997

1k+ parts

$14.481

10k+ parts

-

100

$24.038

$20.997

$14.481

-

DigiKey

USA . 60 parts In-Stock

1+ parts

$36.860

100+ parts

$26.990

1k+ parts

$25.326

10k+ parts

-

60

$36.860

$26.990

$25.326

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 663 parts In-Stock

1+ parts

$22.836

100+ parts

-

1k+ parts

-

10k+ parts

-

663

$22.836

-

-

-

Vyrian

USA . 3,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,170

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,429 parts In-Stock

1+ parts

$21.634

100+ parts

-

1k+ parts

-

10k+ parts

-

2,429

$21.634

-

-

-

Parana Technologies

USA . 392 parts In-Stock

1+ parts

$24.813

100+ parts

-

1k+ parts

$25.490

10k+ parts

-

392

$24.813

-

$25.490

-

ChromeModa Solutions

Germany . 6,654 parts In-Stock

1+ parts

$27.880

100+ parts

$22.862

1k+ parts

-

10k+ parts

-

6,654

$27.880

$22.862

-

-

IDEA Electronic Components Group

UK . 779 parts In-Stock

1+ parts

$27.880

100+ parts

$26.486

1k+ parts

$25.092

10k+ parts

-

779

$27.880

$26.486

$25.092

-

Corohmni

South Africa . 137 parts In-Stock

1+ parts

$37.245

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$37.245

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$42.242

100+ parts

$38.440

1k+ parts

$34.638

10k+ parts

-

500

$42.242

$38.440

$34.638

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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iodParts Technologies Inc.

India . 1,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,320

-

-

-

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DigiPath Technology Company

USA . 504 parts In-Stock

1+ parts

-

100+ parts

$25.137

1k+ parts

-

10k+ parts

-

504

-

$25.137

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-

Perfect Parts

USA . 124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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124

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Overview

Unleash the power of cutting-edge digital signal processing with the TMS320C6421ZDUQ5 by Texas Instruments. This high-quality DSP offers unparalleled performance and efficiency for a wide range of applications. From audio processing to telecommunications, this versatile chip delivers exceptional value and benefits to customers seeking top-tier solutions. Trust in Texas Instruments' reputation for excellence and innovation, and elevate your projects to new heights with the TMS320C6421ZDUQ5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable, suitable for a variety of applications.

Integrated Cache: YES

Enhances the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.26 V

Allows for higher power efficiency and performance.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage.

Address Bus Width: 22

Enables the DSP to efficiently manage memory addressing.

Package Shape: SQUARE

Provides a compact form factor for easy integration into designs.

Bit Size: 32

Provides high computational capabilities for demanding applications.

Power Supplies (V): 1.2,1.8,3.3

Offers flexibility in power options for different system requirements.

No. of Terminals: 376

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY

Facilitates a reliable and secure connection to the PCB.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even at lower power levels.

Maximum Operating Temperature: 85 °C

Allows the DSP to function efficiently in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and durable finish for the terminals.

Terminal Position: BOTTOM

Facilitates easier PCB layout and assembly.

Maximum Seated Height: 2.48 mm

Allows for a low-profile design in space-constrained applications.

RAM Words: 12288

Provides ample memory capacity for data storage and processing.

Width: 23 mm

Compact size for easy integration into various systems.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during production.

External Data Bus Width: 8

Efficient data transfer between the DSP and external components.

Maximum Clock Frequency: 500 MHz

Provides high-speed processing capabilities for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering of the DSP during PCB assembly.

Peak Reflow Temperature °C: 260

Optimal temperature for soldering the DSP onto the PCB.

Internal Bus Architecture: MULTIPLE

Enables efficient data transfer and communication within the DSP.

Length: 23 mm

Compact size for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature ranges.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Provides versatile functionality for a wide range of applications.

No. of Timers: 5

Facilitates time-sensitive operations and scheduling within the DSP.

Technology: CMOS

Energy-efficient technology for enhanced power management.

Terminal Form: BALL

Facilitates soldering and connection to the PCB.

Nominal Supply Voltage: 1.2 V

Optimal voltage for efficient and stable operation of the DSP.

No. of DMA Channels: 72

Enables efficient data transfer and management for high-speed applications.

ROM Programmability: MROM

Provides non-volatile memory for storing essential program data.

Terminal Pitch: 1 mm

Optimal spacing for easy assembly and soldering on the PCB.

Format: FIXED POINT

Suitable for applications requiring fixed-point arithmetic operations.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage during storage and handling.

On Chip Program ROM Width: 8

Efficient storage of program data for quick access and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZDUQ5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT400MHZ

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

500 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

12288

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZDUQ5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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