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TMS320C6416TBZLZA6

Texas Instruments

TMS320C6416TBZLZA6 by Texas Instruments

TMS320C6416TBZLZA6 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock frequency of 75 MHz. Ideal for industrial applications requiring fixed-point technology and low power mode.

Median Price

$129.042

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

1+ parts

$118.660

100+ parts

$111.540

1k+ parts

$104.420

10k+ parts

-

6

$118.660

$111.540

$104.420

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DigiKey

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6

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Verical

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$139.425

1k+ parts

$130.525

10k+ parts

-

6

-

$139.425

$130.525

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,543 parts In-Stock

1+ parts

$130.891

100+ parts

-

1k+ parts

-

10k+ parts

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4,543

$130.891

-

-

-

DigiKey Marketplace

USA . 6 parts In-Stock

1+ parts

$143.290

100+ parts

-

1k+ parts

-

10k+ parts

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6

$143.290

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-

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Vyrian

USA . 2,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,967

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$37.924

100+ parts

$34.511

1k+ parts

$31.098

10k+ parts

-

2,000

$37.924

$34.511

$31.098

-

Parana Technologies

USA . 258 parts In-Stock

1+ parts

$59.138

100+ parts

-

1k+ parts

-

10k+ parts

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258

$59.138

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-

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Corohmni

South Africa . 997 parts In-Stock

1+ parts

$62.111

100+ parts

-

1k+ parts

-

10k+ parts

-

997

$62.111

-

-

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ChromeModa Solutions

Germany . 4,613 parts In-Stock

1+ parts

$66.447

100+ parts

$54.487

1k+ parts

-

10k+ parts

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4,613

$66.447

$54.487

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IDEA Electronic Components Group

UK . 1,232 parts In-Stock

1+ parts

$66.447

100+ parts

$63.125

1k+ parts

$59.802

10k+ parts

-

1,232

$66.447

$63.125

$59.802

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Corphita

USA . 1,190 parts In-Stock

1+ parts

$124.002

100+ parts

-

1k+ parts

-

10k+ parts

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1,190

$124.002

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Microchip USA

USA . 306 parts In-Stock

1+ parts

$138.870

100+ parts

$135.170

1k+ parts

$133.320

10k+ parts

$131.470

306

$138.870

$135.170

$133.320

$131.470

QUARKTWIN TECHNOLOGY LTD

USA . 20,055 parts In-Stock

1+ parts

-

100+ parts

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20,055

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DigiPath Technology Company

USA . 1,739 parts In-Stock

1+ parts

-

100+ parts

$59.909

1k+ parts

-

10k+ parts

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1,739

-

$59.909

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Overview

Experience the power of cutting-edge technology with the TMS320C6416TBZLZA6 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that offer unparalleled performance and reliability. The TMS320C6416TBZLZA6 is perfect for a wide range of applications, providing customers with value, efficiency, and flexibility. Unlock endless possibilities with this innovative product and elevate your projects to new heights. Choose Texas Instruments for superior quality and unmatched excellence in every digital processing need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the DSP lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.24 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 23

The wide address bus width allows for efficient data processing and handling of large memory addresses.

Package Shape: SQUARE

The square package shape enables easier PCB layout and efficient use of space within electronic devices.

Bit Size: 32

With a 32-bit architecture, the DSP can perform complex calculations and processing tasks with high precision and accuracy.

Power Supplies (V): 1.2,3.3

Having multiple power supply options (1.2V and 3.3V) allows for flexibility in voltage requirements for different applications.

No. of Terminals: 532

The high number of terminals provide ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensure reliable connections and good signal integrity in high-density PCB designs.

Minimum Supply Voltage: 1.16 V

The low minimum supply voltage ensures stable operation even under low power conditions, improving overall efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes the DSP suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the DSP to function in extreme cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the PCB layout and enhances thermal dissipation for better heat management.

Maximum Seated Height: 3.25 mm

The low maximum seated height allows for a compact overall design and easier integration into space-constrained devices.

RAM Words: 16384

The large RAM capacity of 16384 words enables efficient data storage and processing for demanding computational tasks.

Width: 23 mm

The compact width of 23mm makes the DSP suitable for applications where space is limited or where a smaller form factor is desired.

Boundary Scan: YES

The boundary scan capability allows for efficient testing and debugging of the DSP during development and production stages.

External Data Bus Width: 64

The wide external data bus width of 64 bits enables high-speed data transfer and processing capabilities for demanding applications.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency of 75MHz ensures quick data processing and rapid response times for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds prevents overheating and ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the DSP can withstand high-temperature soldering processes without damage.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data transfer between different processing units within the DSP for parallel processing.

Length: 23 mm

The compact length of 23mm complements the width, making the DSP suitable for space-constrained designs where a small footprint is critical.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting multiple peripheral IC types, including digital signal processors and others, enhances the versatility and compatibility of the DSP.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds for efficient signal processing.

Terminal Form: BALL

The ball terminal form provides reliable solder joints and good electrical connections, ensuring stable performance under various conditions.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures consistent and reliable power delivery to the DSP for optimal performance.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting and facilitates close spacing of components for compact designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances speed and efficiency in processing numerical data within the DSP.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the DSP can withstand exposure to moderate levels of moisture during storage and handling.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state when high processing performance is not required, conserving energy.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBZLZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBZLZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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