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TMS320C6416TBGLZ1

Texas Instruments

TMS320C6416TBGLZ1 by Texas Instruments

TMS320C6416TBGLZ1 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 75 MHz. It features 262144 RAM words and a 64-bit external data bus width. Ideal for digital signal processing applications requiring high-speed performance and low power consumption.

Median Price

$408.450

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 790 parts In-Stock

1+ parts

$315.923

100+ parts

$306.421

1k+ parts

$237.536

10k+ parts

-

790

$315.923

$306.421

$237.536

-

Rochester

USA . 72 parts In-Stock

1+ parts

$326.760

100+ parts

$307.150

1k+ parts

$287.550

10k+ parts

-

72

$326.760

$307.150

$287.550

-

DigiKey

USA . 72 parts In-Stock

1+ parts

$408.450

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$408.450

-

-

-

Verical

USA . 52 parts In-Stock

1+ parts

$408.450

100+ parts

$383.938

1k+ parts

$359.438

10k+ parts

-

52

$408.450

$383.938

$359.438

-

Mouser Electronics

USA . 18 parts In-Stock

1+ parts

$465.290

100+ parts

-

1k+ parts

-

10k+ parts

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18

$465.290

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$284.590

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$284.590

-

-

-

Digiode

USA . 2,052 parts In-Stock

1+ parts

$300.127

100+ parts

-

1k+ parts

-

10k+ parts

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2,052

$300.127

-

-

-

Vyrian

USA . 5,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,523

-

-

-

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Elcom Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,003 parts In-Stock

1+ parts

$14.877

100+ parts

-

1k+ parts

$15.308

10k+ parts

-

1,003

$14.877

-

$15.308

-

DigiPath Technology Company

USA . 684 parts In-Stock

1+ parts

$16.382

100+ parts

-

1k+ parts

-

10k+ parts

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684

$16.382

-

-

-

ChromeModa Solutions

Germany . 5,290 parts In-Stock

1+ parts

$16.716

100+ parts

$13.707

1k+ parts

-

10k+ parts

-

5,290

$16.716

$13.707

-

-

IDEA Electronic Components Group

UK . 1,001 parts In-Stock

1+ parts

$16.716

100+ parts

$15.880

1k+ parts

$15.044

10k+ parts

-

1,001

$16.716

$15.880

$15.044

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Corohmni

South Africa . 658 parts In-Stock

1+ parts

$28.711

100+ parts

-

1k+ parts

-

10k+ parts

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658

$28.711

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-

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Ampacity Inc.

Singapore . 117 parts In-Stock

1+ parts

$268.530

100+ parts

-

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117

$268.530

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-

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Corphita

USA . 4,020 parts In-Stock

1+ parts

$284.331

100+ parts

-

1k+ parts

-

10k+ parts

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4,020

$284.331

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-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$284.590

100+ parts

-

1k+ parts

$270.360

10k+ parts

$264.668

500

$284.590

-

$270.360

$264.668

Microchip USA

USA . 2,065 parts In-Stock

1+ parts

$350.000

100+ parts

$340.670

1k+ parts

$336.000

10k+ parts

$331.340

2,065

$350.000

$340.670

$336.000

$331.340

A-Z Elektronik GmbH

Germany . 963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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963

-

-

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Overview

Unlock the power of cutting-edge technology with the TMS320C6416TBGLZ1 by Texas Instruments, a leading manufacturer in the field of Digital Signal Processors (DSPs). This innovative product offers seamless integration, high performance, and reliability for a wide range of applications. Whether you're in the telecommunications industry, multimedia systems, or industrial automation, this processor provides unmatched value, benefits, and advantages to enhance your projects. Experience the next level of efficiency and precision with the TMS320C6416TBGLZ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

Having an integrated cache improves overall performance by reducing memory access times and increasing processing speed.

Address Bus Width: 23

A wider address bus allows for better memory addressing capabilities and can support larger amounts of memory, enhancing the overall performance of the DSP.

Bit Size: 32

With a 32-bit architecture, the DSP can handle larger data sets and perform more complex calculations, making it a powerful choice for signal processing tasks.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency enables fast data processing and real-time signal analysis, making this DSP suitable for time-critical applications.

ROM Programmability: FLASH

The use of FLASH ROM allows for easy reprogramming of the DSP, enabling firmware updates and customization without the need for external programming tools.

Low Power Mode: YES

The availability of a low power mode helps in energy efficiency and prolongs battery life, making the DSP suitable for portable and battery-operated devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBGLZ1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBGLZ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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