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TMS320C6416TBCLZD1

Texas Instruments

TMS320C6416TBCLZD1 by Texas Instruments

TMS320C6416TBCLZD1 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75 MHz. Ideal for industrial applications requiring high-speed signal processing in digital communication systems.

Median Price

$360.586

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 228 parts In-Stock

1+ parts

$293.753

100+ parts

$284.918

1k+ parts

$220.867

10k+ parts

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228

$293.753

$284.918

$220.867

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DigiKey

USA . 40 parts In-Stock

1+ parts

$427.420

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-

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40

$427.420

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Distributors (In-Stock)

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Flip Electronics

USA . 15 parts In-Stock

1+ parts

$65.140

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15

$65.140

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Digiode

USA . 3,405 parts In-Stock

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$279.065

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3,405

$279.065

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Nova Conductors

Japan . 54 parts In-Stock

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$299.942

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54

$299.942

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Vyrian

USA . 5,868 parts In-Stock

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5,868

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Cyclops Electronics Ltd

UK . 32 parts In-Stock

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32

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Distributors (Availability)

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AZTECH Wire

Italy . 866 parts In-Stock

1+ parts

$12.379

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-

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866

$12.379

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Corohmni

South Africa . 2,035 parts In-Stock

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$44.206

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2,035

$44.206

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Parana Technologies

USA . 1,746 parts In-Stock

1+ parts

$51.284

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1,746

$51.284

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DigiPath Technology Company

USA . 1,396 parts In-Stock

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$56.470

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$51.952

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1,396

$56.470

$51.952

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IDEA Electronic Components Group

UK . 1,751 parts In-Stock

1+ parts

$57.622

100+ parts

$54.741

1k+ parts

$51.860

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1,751

$57.622

$54.741

$51.860

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ChromeModa Solutions

Germany . 1,258 parts In-Stock

1+ parts

$57.622

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$47.250

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1,258

$57.622

$47.250

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Ampacity Inc.

Singapore . 34 parts In-Stock

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$249.690

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34

$249.690

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Corphita

USA . 98 parts In-Stock

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$264.378

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98

$264.378

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Continental Prestige Electronics

USA . 3,343 parts In-Stock

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$299.942

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$293.943

3,343

$299.942

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-

$293.943

Netroflash

USA . 1,000 parts In-Stock

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$299.942

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1,000

$299.942

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Microchip USA

USA . 9,151 parts In-Stock

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$448.410

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$448.410

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Argo Parts USA

USA . 2,083 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,824 parts In-Stock

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Perfect Parts

USA . 134 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the TMS320C6416TBCLZD1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior quality digital signal processors like no other. The TMS320C6416TBCLZD1 is perfect for a wide range of applications, providing integrated cache, multiple power supplies, and a high-speed clock frequency. Experience seamless operation and enhanced functionality with this cutting-edge DSP, offering customers unmatched value and benefits in their projects. Elevate your designs with the TMS320C6416TBCLZD1 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency, making this product suitable for applications requiring fast data retrieval.

Surface Mount: YES

The surface mount design allows for easy installation on printed circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 1.24 V

With a maximum supply voltage of 1.24V, this product is energy-efficient and suitable for low-power applications.

Address Bus Width: 20

The 20-bit address bus width allows for efficient memory access, enhancing overall performance in data-intensive tasks.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and allowing for easier integration into various electronic devices.

Bit Size: 32

The 32-bit architecture enables high-speed processing and improved accuracy in calculations, making this product suitable for complex tasks.

Power Supplies (V): 1.2,3.3

The ability to operate with multiple power supplies (1.2V and 3.3V) offers flexibility in voltage requirements, compatible with a wide range of systems.

No. of Terminals: 532

The ample number of terminals provides connectivity options for various external components, allowing for expanded functionality in diverse applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhances thermal performance and facilitates high-speed signal transmission, ideal for demanding environments.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBCLZD1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBCLZD1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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