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TMS320C6415TZLZ8

Texas Instruments

TMS320C6415TZLZ8 by Texas Instruments

TMS320C6415TZLZ8 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and 75 MHz clock frequency. Ideal for digital signal processing applications requiring low power mode, it features a CMOS technology package in a square shape with ball terminals.

Median Price

$252.525

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 212 parts In-Stock

1+ parts

$214.920

100+ parts

$202.020

1k+ parts

$189.130

10k+ parts

-

212

$214.920

$202.020

$189.130

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DigiKey

USA . 212 parts In-Stock

1+ parts

$268.650

100+ parts

-

1k+ parts

-

10k+ parts

-

212

$268.650

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-

-

Verical

USA . 212 parts In-Stock

1+ parts

-

100+ parts

$252.525

1k+ parts

$236.412

10k+ parts

-

212

-

$252.525

$236.412

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,567 parts In-Stock

1+ parts

$237.063

100+ parts

-

1k+ parts

-

10k+ parts

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1,567

$237.063

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-

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Vyrian

USA . 5,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,391

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R&J Components

USA . 158 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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158

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 156 parts In-Stock

1+ parts

$27.084

100+ parts

-

1k+ parts

$32.062

10k+ parts

-

156

$27.084

-

$32.062

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ChromeModa Solutions

Germany . 6,399 parts In-Stock

1+ parts

$30.432

100+ parts

$24.954

1k+ parts

-

10k+ parts

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6,399

$30.432

$24.954

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IDEA Electronic Components Group

UK . 723 parts In-Stock

1+ parts

$30.432

100+ parts

$28.910

1k+ parts

$27.389

10k+ parts

-

723

$30.432

$28.910

$27.389

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Corohmni

South Africa . 401 parts In-Stock

1+ parts

$222.500

100+ parts

-

1k+ parts

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10k+ parts

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401

$222.500

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Corphita

USA . 1,831 parts In-Stock

1+ parts

$224.586

100+ parts

-

1k+ parts

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10k+ parts

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1,831

$224.586

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DigiPath Technology Company

USA . 1,844 parts In-Stock

1+ parts

-

100+ parts

$27.437

1k+ parts

-

10k+ parts

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1,844

-

$27.437

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Overview

Unlock the power of digital signal processing with the TMS320C6415TZLZ8 by Texas Instruments. Designed with precision and reliability in mind, this DSP offers unparalleled performance for a variety of applications. From audio processing to telecommunications, this versatile product delivers exceptional value and benefits to customers looking for cutting-edge technology. Trust in Texas Instruments' proven track record of excellence and choose the TMS320C6415TZLZ8 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology simplifies the PCB assembly process and saves space, making the product suitable for compact designs.

Maximum Supply Voltage: 1.16 V

The low maximum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Address Bus Width: 23

The 23-bit address bus width allows for efficient memory addressing, enabling high-speed data processing.

Package Shape: SQUARE

The square package shape facilitates easy mounting and efficient use of PCB space, making it a convenient choice for designers.

Bit Size: 32

The 32-bit architecture enables the processor to handle complex calculations and processing tasks efficiently.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with various power sources.

No. of Terminals: 532

The high number of terminals allows for a wide range of connectivity options, making the product versatile in application.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch design enhances signal integrity and reliability, ensuring stable performance in challenging environments.

Minimum Supply Voltage: 1.05 V

The low minimum supply voltage supports energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments, making it suitable for industrial applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and improves thermal management, enhancing overall system reliability.

Maximum Seated Height: 3.25 mm

The low maximum seated height enables a slim and compact design, suitable for space-constrained applications.

RAM Words: 16384

The large RAM capacity allows for efficient data storage and retrieval, supporting high-speed processing tasks.

Width: 23 mm

The compact width dimensions make the product suitable for small form factor designs where space is limited.

Boundary Scan: YES

Boundary scan capability facilitates easy testing and debugging of the device during the manufacturing process, ensuring quality and reliability.

External Data Bus Width: 64

The 64-bit external data bus width enables high-speed data transfer and efficient communication with external devices.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency allows for rapid data processing and real-time performance in demanding applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data throughput and computational efficiency, optimizing overall system performance.

Length: 23 mm

The compact length dimensions make the product suitable for designs with space constraints, ensuring efficient use of PCB real estate.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances product compatibility and functionality, making it versatile in application.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances reliability, ensuring secure connections in the system.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage provides a stable operating voltage for the processor, ensuring consistent performance and reliability.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting, enabling compact PCB designs and efficient use of space.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances processing speed, making the product suitable for real-time signal processing tasks.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and extends battery life in portable devices, making it an eco-friendly choice.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TZLZ8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6415TZLZ8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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