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TMS320C6415TGLZ8

Texas Instruments

TMS320C6415TGLZ8 by Texas Instruments

TMS320C6415TGLZ8 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and 75 MHz clock frequency. Ideal for digital signal processing applications requiring high-speed computations in a compact form factor. Features low power mode and boundary scan for efficient power management and testing.

Median Price

$146.964

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 561 parts In-Stock

1+ parts

$135.140

100+ parts

$127.030

1k+ parts

$118.920

10k+ parts

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561

$135.140

$127.030

$118.920

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DigiKey

USA . 561 parts In-Stock

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561

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Verical

USA . 561 parts In-Stock

1+ parts

-

100+ parts

$158.787

1k+ parts

$148.650

10k+ parts

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561

-

$158.787

$148.650

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,322 parts In-Stock

1+ parts

$149.064

100+ parts

-

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3,322

$149.064

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DigiKey Marketplace

USA . 566 parts In-Stock

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$163.190

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566

$163.190

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Vyrian

USA . 8,648 parts In-Stock

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8,648

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,119 parts In-Stock

1+ parts

$21.387

100+ parts

-

1k+ parts

$21.729

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1,119

$21.387

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$21.729

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ChromeModa Solutions

Germany . 5,536 parts In-Stock

1+ parts

$24.030

100+ parts

$19.705

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5,536

$24.030

$19.705

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IDEA Electronic Components Group

UK . 1,010 parts In-Stock

1+ parts

$24.030

100+ parts

$22.828

1k+ parts

$21.627

10k+ parts

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1,010

$24.030

$22.828

$21.627

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$27.123

100+ parts

$24.682

1k+ parts

$22.241

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3,000

$27.123

$24.682

$22.241

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Corohmni

South Africa . 756 parts In-Stock

1+ parts

$139.910

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756

$139.910

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Corphita

USA . 2,643 parts In-Stock

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$141.219

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2,643

$141.219

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QUARKTWIN TECHNOLOGY LTD

USA . 22,363 parts In-Stock

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22,363

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

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$21.665

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156

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$21.665

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Overview

Experience the cutting-edge technology of Texas Instruments with the TMS320C6415TGLZ8 Digital Signal Processor. This powerhouse chip offers unparalleled performance and efficiency in a variety of applications, from telecommunications to audio processing. With Texas Instruments' reputation for quality and innovation, you can trust that this DSP will deliver exceptional results for your projects. Upgrade your systems with the TMS320C6415TGLZ8 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP.

Surface Mount: YES

Allows for easy assembly onto circuit boards, saving time and making the product more efficient.

Maximum Supply Voltage: 1.24 V

Provides stable power to the DSP for optimal performance.

Address Bus Width: 23

Allows for efficient communication within the DSP.

Bit Size: 32

Enables processing of data in 32-bit chunks, enhancing speed and accuracy.

Power Supplies (V): 1.2,3.3

Offers flexibility in power sources for different operating conditions.

No. of Terminals: 532

Provides ample connections for interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Facilitates a compact design and efficient signal transmission.

Minimum Supply Voltage: 1.16 V

Ensures stable operation even at lower power levels.

Maximum Operating Temperature: 90 °C

Can withstand high temperatures, making it suitable for a variety of environments.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without any issues.

Terminal Position: BOTTOM

Facilitates easy integration into circuit boards.

Maximum Seated Height: 3.25 mm

Allows for a low-profile design, saving space in the overall system.

RAM Words: 16384

Provides ample memory for processing data efficiently.

Width: 23 mm

Compact size allows for easy integration into various systems.

Boundary Scan: YES

Enables testing and debugging capabilities for improved software development.

External Data Bus Width: 64

Allows for faster data transfer between the DSP and external components.

Maximum Clock Frequency: 75 MHz

Enables high-speed processing of data for real-time applications.

Internal Bus Architecture: MULTIPLE

Enhances data processing capabilities for complex tasks.

Length: 23 mm

Compact size makes it suitable for space-constrained applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Offers versatile functionality for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high reliability.

Terminal Form: BALL

Provides secure connections for reliable operation.

Nominal Supply Voltage: 1.2 V

Stable power supply for consistent performance.

Terminal Pitch: 0.8 mm

Fine pitch allows for a high number of connections in a small area.

Format: FIXED POINT

Fixed-point format is suitable for many DSP applications, offering efficiency and accuracy.

Low Power Mode: YES

Enables energy-efficient operation and prolongs battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TGLZ8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6415TGLZ8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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