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TMS320C6412GDK500

Texas Instruments

TMS320C6412GDK500 by Texas Instruments

TMS320C6412GDK500 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and 75.19 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode and boundary scan capability.

Median Price

$30.162

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 194 parts In-Stock

1+ parts

-

100+ parts

$26.810

1k+ parts

$23.990

10k+ parts

$22.580

194

-

$26.810

$23.990

$22.580

DigiKey

USA . 194 parts In-Stock

1+ parts

-

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-

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194

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Verical

USA . 134 parts In-Stock

1+ parts

-

100+ parts

$33.513

1k+ parts

$29.988

10k+ parts

$28.225

134

-

$33.513

$29.988

$28.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,559 parts In-Stock

1+ parts

$28.300

100+ parts

-

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1,559

$28.300

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Vyrian

USA . 5,889 parts In-Stock

1+ parts

-

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5,889

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PC Components Company LLC

USA . 1 parts In-Stock

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1

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Bristol Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,871 parts In-Stock

1+ parts

$26.560

100+ parts

-

1k+ parts

-

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2,871

$26.560

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Corphita

USA . 2,812 parts In-Stock

1+ parts

$26.811

100+ parts

-

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2,812

$26.811

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Parana Technologies

USA . 1,154 parts In-Stock

1+ parts

$31.421

100+ parts

-

1k+ parts

$78.927

10k+ parts

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1,154

$31.421

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$78.927

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DigiPath Technology Company

USA . 2,355 parts In-Stock

1+ parts

$34.599

100+ parts

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2,355

$34.599

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IDEA Electronic Components Group

UK . 2,303 parts In-Stock

1+ parts

$35.305

100+ parts

$33.540

1k+ parts

$31.774

10k+ parts

-

2,303

$35.305

$33.540

$31.774

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ChromeModa Solutions

Germany . 827 parts In-Stock

1+ parts

$35.305

100+ parts

$28.950

1k+ parts

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827

$35.305

$28.950

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the potential of your digital signal processing projects with the TMS320C6412GDK500 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. This DSP offers unparalleled performance and reliability, making it ideal for a wide range of applications. From audio processing to telecommunications, this versatile device provides value, efficiency, and innovation like no other. Upgrade your projects today and experience the benefits of using the TMS320C6412GDK500.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the DSP lightweight and durable, making it suitable for portable and rugged applications.

Surface Mount: YES

The surface mount capability ensures easy and efficient integration of the DSP into various electronic devices, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage tolerance provides flexibility and ensures stable operation even in scenarios where voltage fluctuations may occur.

Address Bus Width: 23

With a wide address bus width of 23, the DSP can access and process a large amount of memory locations, improving overall performance and efficiency.

Package Shape: SQUARE

The square package shape allows for easy and standardized mounting on PCBs, optimizing space utilization and ensuring compatibility with existing design layouts.

Bit Size: 32

The 32-bit processing capability ensures high computational power, enabling complex signal processing tasks to be executed quickly and efficiently.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages (1.2V and 3.3V) enables compatibility with different power sources and operating environments, enhancing versatility.

No. of Terminals: 548

With a large number of terminals, the DSP can facilitate extensive connectivity options, enabling interfacing with various external devices and peripherals.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring a reliable electrical connection and ease of assembly during manufacturing.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that the DSP has a moderate sensitivity to moisture, making it suitable for a wide range of operating environments with varying humidity levels.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412GDK500 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412GDK500 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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