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TMS320C6412AGDK5

Texas Instruments

TMS320C6412AGDK5 by Texas Instruments

TMS320C6412AGDK5 by Texas Instruments is a 32-bit DSP with integrated cache, 262144 RAM words, and 64 external DMA channels. It operates at a max clock frequency of 75.19 MHz and is suitable for digital signal processing applications requiring low power consumption and high-speed data processing.

Median Price

$71.117

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,399 parts In-Stock

1+ parts

$71.117

100+ parts

$63.216

1k+ parts

$46.482

10k+ parts

-

1,399

$71.117

$63.216

$46.482

-

Rochester

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$66.810

1k+ parts

$59.780

10k+ parts

$56.260

214

-

$66.810

$59.780

$56.260

DigiKey

USA . 74 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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74

-

-

-

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Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$83.513

1k+ parts

$74.725

10k+ parts

$70.325

50

-

$83.513

$74.725

$70.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$52.330

100+ parts

-

1k+ parts

-

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50

$52.330

-

-

-

Digiode

USA . 2,616 parts In-Stock

1+ parts

$61.332

100+ parts

-

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-

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2,616

$61.332

-

-

-

Vyrian

USA . 3,107 parts In-Stock

1+ parts

-

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-

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3,107

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 204 parts In-Stock

1+ parts

$27.532

100+ parts

-

1k+ parts

-

10k+ parts

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204

$27.532

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$52.330

100+ parts

$51.283

1k+ parts

-

10k+ parts

-

1,000

$52.330

$51.283

-

-

Ampacity Inc.

Singapore . 312 parts In-Stock

1+ parts

$54.880

100+ parts

-

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-

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312

$54.880

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Corphita

USA . 3,134 parts In-Stock

1+ parts

$58.104

100+ parts

-

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3,134

$58.104

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Parana Technologies

USA . 1,966 parts In-Stock

1+ parts

$75.944

100+ parts

-

1k+ parts

-

10k+ parts

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1,966

$75.944

-

-

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DigiPath Technology Company

USA . 372 parts In-Stock

1+ parts

$83.623

100+ parts

-

1k+ parts

-

10k+ parts

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372

$83.623

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-

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IDEA Electronic Components Group

UK . 1,850 parts In-Stock

1+ parts

$85.330

100+ parts

$81.064

1k+ parts

$76.797

10k+ parts

-

1,850

$85.330

$81.064

$76.797

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ChromeModa Solutions

Germany . 1,268 parts In-Stock

1+ parts

$85.330

100+ parts

$69.971

1k+ parts

-

10k+ parts

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1,268

$85.330

$69.971

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Microchip USA

USA . 1,245 parts In-Stock

1+ parts

$154.420

100+ parts

$151.740

1k+ parts

$150.390

10k+ parts

$149.050

1,245

$154.420

$151.740

$150.390

$149.050

Perfect Parts

USA . 57 parts In-Stock

1+ parts

-

100+ parts

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57

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Overview

Unlock the power of cutting-edge technology with the TMS320C6412AGDK5 by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and reliability in digital signal processors (DSPs). This versatile product offers integrated cache, surface mount capability, and multiple power supplies to meet a variety of application needs. Whether you're working on telecommunications, audio processing, or industrial control systems, this DSP provides exceptional value, performance, and efficiency. Take your projects to the next level with the TMS320C6412AGDK5 and experience the difference Texas Instruments can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for package body makes the product lightweight and durable, which is ideal for portable devices.

Integrated Cache: YES

The presence of integrated cache helps in improving the overall performance of the DSP by reducing the access time to frequently used instructions and data.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage of 1.26V ensures efficient power consumption and reduces the risk of overheating, resulting in better energy efficiency.

Address Bus Width: 23

With a wide address bus width of 23, the DSP can access a large memory space efficiently, enabling it to handle complex signal processing tasks effectively.

Package Shape: SQUARE

The square package shape allows for easy mounting and space-saving on circuit boards, making it suitable for compact electronic devices.

Bit Size: 32

The 32-bit architecture of the DSP enables it to process data in larger chunks, increasing the speed and efficiency of signal processing operations.

Power Supplies (V): 1.2,3.3

Having multiple power supply options of 1.2V and 3.3V provides flexibility in designing the power system for the DSP to meet different application requirements.

No. of Terminals: 548

The high number of terminals (548) allows for multiple connections and interfaces, enabling the DSP to communicate with various external components efficiently.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, this product is specifically designed for fast and efficient signal processing applications, making it a reliable choice for audio, video, and communication systems. The inclusion of other peripheral ICs enhances its versatility to support a wide range of functions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412AGDK5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412AGDK5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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