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TMS320C6211GFN150

Texas Instruments

TMS320C6211GFN150 by Texas Instruments

TMS320C6211GFN150 by Texas Instruments is a 32-bit DSP with 22-bit address bus, operating at 150 MHz. It features 1024 RAM words, low power mode, and boundary scan. Ideal for digital signal processing applications requiring high clock frequency and multiple internal bus architecture.

Median Price

$23.880

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$20.660

1k+ parts

$18.490

10k+ parts

$17.400

23

-

$20.660

$18.490

$17.400

DigiKey

USA . 23 parts In-Stock

1+ parts

-

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$23.880

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23

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$23.880

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Verical

USA . 23 parts In-Stock

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-

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$26.975

1k+ parts

$24.400

10k+ parts

-

23

-

$26.975

$24.400

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 97 parts In-Stock

1+ parts

$21.812

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97

$21.812

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Vyrian

USA . 2,865 parts In-Stock

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2,865

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Semi Source

USA . 779 parts In-Stock

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779

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Bristol Electronics

USA . 253 parts In-Stock

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DigiKey Marketplace

USA . 23 parts In-Stock

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Netsource Technology, Inc.

USA . 22 parts In-Stock

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M&R Communications

USA . 19 parts In-Stock

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Zilex Electronics Inc.

Canada . 2 parts In-Stock

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North Shore Components

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,537 parts In-Stock

1+ parts

$18.710

100+ parts

-

1k+ parts

$18.803

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1,537

$18.710

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$18.803

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Ampacity Inc.

Singapore . 23 parts In-Stock

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$19.520

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23

$19.520

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Corphita

USA . 666 parts In-Stock

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$20.664

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666

$20.664

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ChromeModa Solutions

Germany . 4,463 parts In-Stock

1+ parts

$21.023

100+ parts

$17.239

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4,463

$21.023

$17.239

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IDEA Electronic Components Group

UK . 84 parts In-Stock

1+ parts

$21.023

100+ parts

$19.972

1k+ parts

$18.921

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84

$21.023

$19.972

$18.921

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Component Stockers USA

USA . 21 parts In-Stock

1+ parts

$23.220

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$23.220

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Microchip USA

USA . 198 parts In-Stock

1+ parts

$50.690

100+ parts

$49.810

1k+ parts

$49.370

10k+ parts

$48.930

198

$50.690

$49.810

$49.370

$48.930

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$58.024

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365

$58.024

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DigiPath Technology Company

USA . 780 parts In-Stock

1+ parts

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$18.954

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780

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$18.954

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Overview

Experience the unparalleled performance and reliability of the TMS320C6211GFN150 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch digital signal processors that are perfect for a wide range of applications. From audio processing to telecommunications, this DSP offers exceptional value and benefits to customers. With advanced technology and innovative features, the TMS320C6211GFN150 provides high-speed processing and low power consumption, making it the ideal choice for your next project. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.89 V

The higher maximum supply voltage allows for more flexibility in power supply options.

Address Bus Width: 22

A wider address bus width enables the processor to access a larger range of memory locations.

Package Shape: SQUARE

Square package shape is space-efficient and easy to handle during assembly.

Bit Size: 32

A 32-bit architecture allows for processing larger amounts of data at once, improving performance.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options for different system requirements.

No. of Terminals: 256

A higher number of terminals provide more connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY

Grid array package style offers high-density packaging for compact design.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 90 °C

High maximum operating temperature tolerance ensures reliable operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

The processor can operate in low-temperature environments without any issues.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing of traces.

Maximum Seated Height: 2.32 mm

Low seated height makes the product suitable for compact and thin devices.

RAM Words: 1024

Ample RAM capacity for storing and processing data efficiently.

Width: 27 mm

Compact width dimension allows for space-saving integration in electronic devices.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging of the processor during manufacturing and maintenance.

External Data Bus Width: 32

Matching the bit size, a 32-bit external data bus ensures smooth communication with other components.

Maximum Clock Frequency: 150 MHz

High clock frequency allows for fast data processing, enhancing overall system performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enables efficient data flow and parallel processing capabilities.

Length: 27 mm

Compact length dimension for easy integration in space-constrained designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports various types of peripheral ICs for enhanced functionality and connectivity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form ensures secure connections and reliable soldering during assembly.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent and reliable operation of the processor.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for ease of assembly and compatibility with standard PCB layouts.

Format: FIXED POINT

Fixed-point format enables efficient arithmetic and processing of integer data types.

Low Power Mode: YES

Low power mode option for reducing power consumption during idle or low-demand periods, increasing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6211GFN150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6211GFN150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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