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TMS320C6204ZWTA200

Texas Instruments

TMS320C6204ZWTA200 by Texas Instruments

TMS320C6204ZWTA200 by Texas Instruments is a 32-bit DSP with 288 terminals, operating at max 200 MHz. It features integrated cache, 65536 RAM words, and boundary scan support. Ideal for industrial applications requiring high-speed signal processing in compact form factors.

Median Price

$24.420

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 180 parts In-Stock

1+ parts

$24.420

100+ parts

$19.230

1k+ parts

$17.460

10k+ parts

$15.660

180

$24.420

$19.230

$17.460

$15.660

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,735 parts In-Stock

1+ parts

$23.199

100+ parts

-

1k+ parts

-

10k+ parts

-

1,735

$23.199

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-

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Vyrian

USA . 7,937 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

-

7,937

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,940 parts In-Stock

1+ parts

$21.978

100+ parts

-

1k+ parts

-

10k+ parts

-

3,940

$21.978

-

-

-

Microchip USA

USA . 1,193 parts In-Stock

1+ parts

$25.840

100+ parts

$25.470

1k+ parts

$25.290

10k+ parts

$25.110

1,193

$25.840

$25.470

$25.290

$25.110

Parana Technologies

USA . 1,349 parts In-Stock

1+ parts

$42.684

100+ parts

-

1k+ parts

-

10k+ parts

-

1,349

$42.684

-

-

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ChromeModa Solutions

Germany . 1,662 parts In-Stock

1+ parts

$47.959

100+ parts

$39.326

1k+ parts

-

10k+ parts

-

1,662

$47.959

$39.326

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IDEA Electronic Components Group

UK . 951 parts In-Stock

1+ parts

$47.959

100+ parts

$45.561

1k+ parts

$43.163

10k+ parts

-

951

$47.959

$45.561

$43.163

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Corohmni

South Africa . 4,866 parts In-Stock

1+ parts

$85.462

100+ parts

-

1k+ parts

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10k+ parts

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4,866

$85.462

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Component Stockers USA

USA . 793 parts In-Stock

1+ parts

$99.990

100+ parts

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793

$99.990

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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DigiPath Technology Company

USA . 1,060 parts In-Stock

1+ parts

-

100+ parts

$43.240

1k+ parts

-

10k+ parts

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1,060

-

$43.240

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Overview

Unlock the power of digital signal processing with the TMS320C6204ZWTA200 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this DSP. Ideal for a wide range of applications, from audio processing to telecommunications, this DSP offers high performance and efficiency to meet your needs. Experience the value and benefits of superior processing power and integrated cache, all in a compact package that will elevate your projects to the next level. Choose Texas Instruments for unmatched quality and innovation in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the DSP, making it resistant to damage from external elements.

Integrated Cache: YES

Having an integrated cache allows for faster data retrieval and processing, improving the overall performance of the DSP.

Maximum Supply Voltage: 1.57 V

The higher maximum supply voltage allows for efficient power utilization and potentially higher performance capabilities.

Address Bus Width: 22

With a wide address bus width, the DSP can handle larger amounts of data, making it suitable for complex signal processing tasks.

Bit Size: 32

A 32-bit architecture enables the DSP to process data in larger chunks, leading to faster and more efficient signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the DSP energy-efficient and high-performing.

Maximum Clock Frequency: 200 MHz

With a high maximum clock frequency, the DSP can perform calculations and process data at a rapid pace, suitable for real-time signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6204ZWTA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6204ZWTA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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