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TMS320C6204ZHKA200

Texas Instruments

TMS320C6204ZHKA200 by Texas Instruments

TMS320C6204ZHKA200 by Texas Instruments is a 32-bit DSP with 8-word cache, 22-bit address bus, and 32-bit external data bus. Ideal for industrial applications, it operates at up to 200MHz clock frequency and features low power mode with 1.5V nominal voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,460 parts In-Stock

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Digiode

USA . 750 parts In-Stock

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750

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One Stop Electronics

USA . 1,499 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 609 parts In-Stock

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$9.427

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Corohmni

South Africa . 316 parts In-Stock

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$15.943

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Parana Technologies

USA . 1,002 parts In-Stock

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$75.440

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DigiPath Technology Company

USA . 2,236 parts In-Stock

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$83.069

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ChromeModa Solutions

Germany . 5,611 parts In-Stock

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$84.764

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$69.506

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

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$84.764

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$80.526

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$76.288

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Corphita

USA . 1,408 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Unleash the power of cutting-edge technology with the TMS320C6204ZHKA200 by Texas Instruments. This Digital Signal Processor (DSP) boasts integrated cache and a wide array of features designed to elevate your projects to new heights. With Texas Instruments' reputation for excellence in the industry, you can trust that this product delivers top-notch performance and reliability. Whether you're working on audio processing, telecommunications, or industrial control applications, the TMS320C6204ZHKA200 offers unmatched value, benefits, and advantages that will take your designs to the next level. Upgrade your projects today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and durability for the DSP, making it suitable for various environments and applications.

Integrated Cache: YES

Integrated cache helps in improving the processing speed and efficiency of the DSP, leading to better performance in handling complex signal processing tasks.

Maximum Supply Voltage: 1.57 V

Having a maximum supply voltage of 1.57 V ensures safe operation and prevents the risk of damage due to overvoltage scenarios.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM allows for efficient data storage and retrieval, aiding in the smooth execution of signal processing algorithms.

Address Bus Width: 22

A wider address bus width of 22 bits enables the DSP to access a larger memory space, facilitating the handling of extensive data and operations.

Bit Size: 32

The 32-bit architecture of the DSP allows for processing large chunks of data at a time, enhancing the speed and performance of signal processing tasks.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages (1.5V and 3.3V) ensures flexibility in designing and powering the DSP system as per the application requirements.

No. of Terminals: 288

Having 288 terminals provides ample connectivity options for integrating the DSP with other components and peripherals in a system.

Width: 16 mm

Compact width of 16mm allows for space-efficient integration of the DSP into various devices and systems with size constraints.

Maximum Clock Frequency: 200 MHz

High maximum clock frequency of 200 MHz enables the DSP to swiftly process signals and perform computations, making it suitable for real-time applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6204ZHKA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6204ZHKA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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