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TMS320C6202GLS250

Texas Instruments

TMS320C6202GLS250 by Texas Instruments

TMS320C6202GLS250 by Texas Instruments is a 32-bit DSP with 32768 RAM words, 250 MHz clock frequency, and 384 terminals. It is used in digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

$195.032

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 287 parts In-Stock

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$179.340

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$168.580

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$157.820

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$157.820

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Verical

USA . 120 parts In-Stock

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$210.725

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$197.275

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Bristol Electronics

USA . 209 parts In-Stock

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$78.000

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$63.960

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DigiKey Marketplace

USA . 287 parts In-Stock

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$196.890

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Digiode

USA . 3,200 parts In-Stock

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$197.828

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Vyrian

USA . 7,865 parts In-Stock

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Semi Source

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LWI Electronics Inc

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Microfarads

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 130 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 85 parts In-Stock

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Semtec, LLC

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Sogenti Electronics

Canada . 14 parts In-Stock

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M&R Communications

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Distributors (Availability)

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Corohmni

South Africa . 1,043 parts In-Stock

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$40.876

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$40.876

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Parana Technologies

USA . 516 parts In-Stock

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$52.032

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$4,831.967

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$46.829

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516

$52.032

$4,831.967

$46.829

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DigiPath Technology Company

USA . 2,061 parts In-Stock

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$57.294

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ChromeModa Solutions

Germany . 2,400 parts In-Stock

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$58.463

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$47.940

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$58.463

$47.940

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IDEA Electronic Components Group

UK . 1,138 parts In-Stock

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$58.463

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$55.540

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$52.617

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Ampacity Inc.

Singapore . 116 parts In-Stock

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$177.000

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Corphita

USA . 3,682 parts In-Stock

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$187.416

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Component Stockers USA

USA . 322 parts In-Stock

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$196.100

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$184.330

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Microchip USA

USA . 1,998 parts In-Stock

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$220.910

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$215.020

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$212.080

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$209.130

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$220.910

$215.020

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$209.130

QUARKTWIN TECHNOLOGY LTD

USA . 22,193 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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GreenTree Electronics

Israel . 22 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320C6202GLS250 by Texas Instruments. This high-quality Digital Signal Processor offers seamless integration, advanced features, and unparalleled performance. Perfect for a wide range of applications, this product is designed to exceed expectations. Trust in Texas Instruments' reputation for excellence and innovation, and unlock the value, benefits, and advantages that the TMS320C6202GLS250 brings to your projects. Elevate your work with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material ensures durability and protection for the DSP, making it suitable for various environments and applications.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the DSP, making it ideal for tasks requiring quick data access.

Maximum Supply Voltage: 1.89 V

The maximum supply voltage of 1.89 V allows for higher performance while still maintaining power efficiency in operation.

On Chip Data RAM Width: 8

With a wider on-chip data RAM width of 8, the DSP can handle larger amounts of data simultaneously, enhancing its processing capabilities.

Address Bus Width: 22

A larger address bus width of 22 enables the DSP to access a larger memory space, which is beneficial for complex algorithms and computations.

Bit Size: 32

The 32-bit architecture of the DSP allows for high precision and accuracy in processing digital signals, making it suitable for advanced signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supplies at 1.8V and 3.3V offers flexibility in powering the DSP and compatibility with different voltage requirements in systems.

No. of Terminals: 384

The high number of terminals provide ample connectivity options for peripherals and external components, allowing for versatile integration in various systems.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature tolerance of 90°C enables the DSP to perform reliably in demanding environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature limit of 0°C ensures the DSP can function effectively in colder conditions without any performance degradation.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and communication within the DSP, leading to efficient processing and optimal performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202GLS250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B384

JESD-609 Code:

e0

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

384

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA384,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

18 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202GLS250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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