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TMS320C6202BGNY300

Texas Instruments

TMS320C6202BGNY300 by Texas Instruments

TMS320C6202BGNY300 by Texas Instruments is a 32-bit DSP with 300 MHz clock frequency, 384 terminals, and 32768 RAM words. It is used in digital signal processing applications requiring high-speed data processing and integrated cache memory for efficient operations.

Median Price

$122.805

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 63 parts In-Stock

1+ parts

-

100+ parts

$109.160

1k+ parts

$97.670

10k+ parts

$91.920

63

-

$109.160

$97.670

$91.920

Verical

USA . 63 parts In-Stock

1+ parts

-

100+ parts

$136.450

1k+ parts

$122.088

10k+ parts

$114.900

63

-

$136.450

$122.088

$114.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 9 parts In-Stock

1+ parts

$109.622

100+ parts

-

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9

$109.622

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DigiKey Marketplace

USA . 63 parts In-Stock

1+ parts

$109.870

100+ parts

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63

$109.870

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-

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Digiode

USA . 3,330 parts In-Stock

1+ parts

$110.390

100+ parts

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3,330

$110.390

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Vyrian

USA . 8,481 parts In-Stock

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8,481

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Dan-Mar Components

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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Corohmni

South Africa . 608 parts In-Stock

1+ parts

$16.744

100+ parts

-

1k+ parts

-

10k+ parts

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608

$16.744

-

-

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Parana Technologies

USA . 2,353 parts In-Stock

1+ parts

$39.414

100+ parts

-

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10k+ parts

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2,353

$39.414

-

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DigiPath Technology Company

USA . 1,268 parts In-Stock

1+ parts

$43.399

100+ parts

$39.927

1k+ parts

-

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-

1,268

$43.399

$39.927

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ChromeModa Solutions

Germany . 3,753 parts In-Stock

1+ parts

$44.285

100+ parts

$36.314

1k+ parts

-

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3,753

$44.285

$36.314

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IDEA Electronic Components Group

UK . 1,536 parts In-Stock

1+ parts

$44.285

100+ parts

$42.071

1k+ parts

$39.856

10k+ parts

-

1,536

$44.285

$42.071

$39.856

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Corphita

USA . 4,664 parts In-Stock

1+ parts

$104.580

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4,664

$104.580

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Microchip USA

USA . 954 parts In-Stock

1+ parts

$169.005

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954

$169.005

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Perfect Parts

USA . 202 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320C6202BGNY300 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers top-quality digital signal processors that are versatile and reliable. Ideal for a wide range of applications, this product provides seamless performance and efficiency. With integrated cache, multiple power supplies, and boundary scan capabilities, the TMS320C6202BGNY300 delivers unmatched value to customers seeking advanced solutions for their projects. Upgrade your systems with this innovative DSP and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Integrated Cache: YES

Having integrated cache helps in improving the speed and efficiency of data processing, making the product suitable for high-performance tasks.

Maximum Supply Voltage: 1.57 V

Operating at a maximum supply voltage of 1.57V ensures efficient power consumption, making it energy-efficient.

On Chip Data RAM Width: 8

With a wider on-chip data RAM width of 8, the product can handle larger amounts of data simultaneously, enhancing its processing capabilities.

Address Bus Width: 22

The wide address bus width of 22 allows for addressing a larger memory space, making it suitable for applications requiring extensive memory usage.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy mounting on a PCB, making it convenient for compact designs.

Bit Size: 32

Operating with a bit size of 32 ensures high precision and accuracy in processing data, beneficial for applications demanding accuracy.

Power Supplies (V): 1.5,3.3

Supporting multiple power supply options of 1.5V and 3.3V provides flexibility in designing and compatibility with various power sources.

No. of Terminals: 384

Having a high number of terminals allows for the connection of various external devices and peripherals, expanding the product's functionality.

Minimum Supply Voltage: 1.43 V

Operating at a low minimum supply voltage of 1.43V ensures energy efficiency and reliable performance even under low-power conditions.

Maximum Operating Temperature: 90 °C

Being able to operate at a high temperature of 90°C enables the product to function in demanding environmental conditions without overheating.

No. of External Interrupts: 4

Supporting 4 external interrupts allows for the product to respond to external events promptly, increasing responsiveness in real-time applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the product can function reliably even in cold environments, suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good solderability and reliability in PCB assembly, making it easy to integrate into electronic systems.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy mounting on a PCB, simplifying the assembly process and optimizing space usage.

Maximum Seated Height: 2.35 mm

With a maximum seated height of 2.35mm, the product offers a low profile design, suitable for slim and compact electronic devices.

RAM Words: 32768

With a large RAM word size of 32768, the product can store and manipulate a significant amount of data, enhancing its processing capabilities.

Width: 18 mm

The product's width of 18mm allows for easy integration into different system designs and PCB layouts, providing versatility in applications.

Boundary Scan: YES

Incorporating boundary scan capability enables efficient testing and debugging of the product during manufacturing, ensuring product quality and reliability.

External Data Bus Width: 32

Having an external data bus width of 32 enables faster data transfer between the processor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 300 MHz

Operating at a maximum clock frequency of 300MHz ensures high-speed data processing, making the product suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 20

With a maximum time of 20s at peak reflow temperature, the product can endure high-temperature soldering processes, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 220

Having a peak reflow temperature of 220°C allows for efficient and effective soldering during PCB assembly, ensuring secure connections and optimal performance.

Internal Bus Architecture: MULTIPLE

Employing multiple internal bus architecture enhances data flow and communication within the processor, optimizing performance and efficiency.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with other peripheral IC type features, the product offers versatile functionality for a wide range of signal processing applications.

No. of Timers: 2

Incorporating 2 timers enables the product to manage and coordinate time-sensitive tasks effectively, enhancing its capability in handling real-time operations.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in various electronic applications.

Terminal Form: BALL

Using ball terminal form simplifies the soldering process and provides reliable electrical connections, ensuring robust performance in different environments.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5V ensures consistent and stable performance, suitable for a wide range of electronic systems.

No. of DMA Channels: 4

Having 4 DMA channels allows for efficient data transfer between peripherals and memory, improving overall system performance and responsiveness.

ROM Programmability: MROM

The MROM programmability feature ensures essential program code remains intact, providing security and reliability in critical applications.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the product offers compatibility with standard PCB layouts, making it easy to integrate into existing electronic designs.

Format: FIXED POINT

Operating in fixed-point format enables efficient and fast mathematical calculations, making the product suitable for applications requiring real-time data processing.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates the product's resistance to moisture-related issues, ensuring reliability in different environmental conditions.

Low Power Mode: YES

The availability of a low power mode enhances energy efficiency, prolonging battery life and making the product suitable for portable and battery-powered devices.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, the product can store and execute program code efficiently, enhancing its overall performance and responsiveness.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202BGNY300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B384

JESD-609 Code:

e0

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

384

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA384,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

2.35 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

18 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202BGNY300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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