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TMS320C6201GJC200

Texas Instruments

TMS320C6201GJC200 by Texas Instruments

TMS320C6201GJC200 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 200 MHz. It has 22-bit address bus width and 16384 RAM words. Widely used in digital signal processing applications due to its low power mode and boundary scan feature.

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LIBRA Elektronik GmbH

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LWI Electronics Inc

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PC Components Company LLC

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One Stop Electronics

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Microchip USA

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Advanced Electronics

New Zealand . 550 parts In-Stock

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Parana Technologies

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Overview

Experience unparalleled performance and reliability with the TMS320C6201GJC200 by Texas Instruments, a leader in cutting-edge technology. As a top-notch Digital Signal Processor (DSP), this product is designed to meet the demands of a variety of applications. From audio processing to telecommunications, the TMS320C6201GJC200 offers exceptional value with its integrated cache, low power mode, and high clock frequency. Trust Texas Instruments for quality you can rely on and elevate your projects with the unmatched capabilities of the TMS320C6201GJC200.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to external elements, making the product sturdy and long-lasting.

Integrated Cache: YES

Integrated cache enhances the performance of the DSP by storing frequently accessed data for quick retrieval, resulting in faster processing speeds.

Maximum Supply Voltage: 1.89 V

Higher maximum supply voltage allows for efficient power management and optimization of performance without compromising on stability.

Bit Size: 32

A 32-bit architecture enables the DSP to handle complex mathematical calculations and data processing tasks with precision and accuracy.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture facilitates parallel processing of data within the DSP, improving overall efficiency and speed of operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6201GJC200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

35 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

352

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.5 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

35 mm

Peripheral IC Type:

Trade Compliance

TMS320C6201GJC200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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