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TMS320C32PCM50

Texas Instruments

TMS320C32PCM50 by Texas Instruments

TMS320C32PCM50 by Texas Instruments is a 32-bit DSP with 32-bit data RAM and 24-bit address bus. Operating at up to 50 MHz, it features low power mode and barrel shifter. Ideal for digital signal processing applications requiring high-speed calculations in a compact form factor.

Median Price

$41.160

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$41.160

100+ parts

$40.340

1k+ parts

$39.510

10k+ parts

-

1

$41.160

$40.340

$39.510

-

Distributors (In-Stock)

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Digiode

USA . 294 parts In-Stock

1+ parts

$44.327

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294

$44.327

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Vyrian

USA . 4,503 parts In-Stock

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4,503

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Chip Stock

USA . 505 parts In-Stock

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505

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Prism Electronics

USA . 25 parts In-Stock

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25

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SPM Sales

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Mentor Electronics Marketing, LLC

USA . 3 parts In-Stock

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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Sogenti Electronics

Canada . 2 parts In-Stock

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2

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Zilex Electronics Inc.

Canada . 1 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$8.124

100+ parts

-

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644

$8.124

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$39.660

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1

$39.660

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Parana Technologies

USA . 1,795 parts In-Stock

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$40.640

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$40.640

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Corphita

USA . 3,993 parts In-Stock

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$41.994

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$41.994

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DigiPath Technology Company

USA . 716 parts In-Stock

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$44.750

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$41.170

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716

$44.750

$41.170

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ChromeModa Solutions

Germany . 281 parts In-Stock

1+ parts

$45.663

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$37.444

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281

$45.663

$37.444

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IDEA Electronic Components Group

UK . 184 parts In-Stock

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$45.663

100+ parts

$43.380

1k+ parts

$41.097

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184

$45.663

$43.380

$41.097

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Corohmni

South Africa . 700 parts In-Stock

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$60.750

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$60.750

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A-Z Elektronik GmbH

Germany . 2,573 parts In-Stock

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Continental Prestige Electronics

USA . 2,450 parts In-Stock

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Argo Parts USA

USA . 1,432 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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560

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Aranea Global

USA . 50 parts In-Stock

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50

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Computer Components Inc. - USA

USA . 29 parts In-Stock

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29

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Overview

Unleash the power of next-generation technology with the TMS320C32PCM50 by Texas Instruments. As a leader in the field of Digital Signal Processors, Texas Instruments ensures top-notch quality and reliability in all their products. The TMS320C32PCM50 is no exception, offering high performance and efficiency in a compact package. Ideal for a wide range of applications, this DSP provides unparalleled value and benefits to customers looking to elevate their projects to new heights. Experience the advantage of cutting-edge technology with the TMS320C32PCM50 from Texas Instruments.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Surface Mount:

YES - Allows for easy installation and space-saving design.

Maximum Supply Voltage:

5.25 V - Supports high-performance applications without risk of damage.

On Chip Data RAM Width:

32 - Enables efficient processing and storage of data.

Address Bus Width:

24 - Facilitates quick data retrieval and processing.

Package Shape:

SQUARE - Offers a compact form factor for versatile integration.

Bit Size:

32 - Provides high processing power for complex algorithms.

Power Supplies (V):

5 - Operates efficiently within standard voltage ranges.

No. of Terminals:

144 - Allows for seamless connectivity with other components.

Package Style (Meter):

FLATPACK - Ensures easy handling and installation.

Minimum Supply Voltage:

4.75 V - Provides flexibility in power input options.

Maximum Operating Temperature:

85 °C - Can withstand high temperatures for extended operation.

No. of External Interrupts:

4 - Enables external events to trigger immediate responses.

Minimum Operating Temperature:

0 °C - Functions reliably even in low temperature environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures reliable connectivity and prevents corrosion.

Terminal Position:

QUAD - Facilitates easy connection and layout design.

Maximum Seated Height:

4.1 mm - Allows for compact device dimensions.

RAM Words:

512 - Provides ample memory for data storage and processing.

Width:

28 mm - Offers a compact footprint for space-constrained applications.

External Data Bus Width:

32 - Enables high-speed data transfer and processing.

Maximum Clock Frequency:

50 MHz - Supports fast processing speeds for real-time applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper solder reflow for reliable connections.

Peak Reflow Temperature °C:

245 - Supports efficient soldering processes without damage.

Internal Bus Architecture:

MULTIPLE - Optimizes data flow for improved performance.

Length:

28 mm - Provides a balanced form factor for various applications.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - Offers versatile capabilities for diverse signal processing needs.

No. of Timers:

2 - Enables time-sensitive operations and scheduling functions.

Technology:

CMOS - Ensures low power consumption and high efficiency.

Terminal Form:

GULL WING - Facilitates secure and reliable soldering connections.

Maximum Supply Current:

425 mA - Supports power-hungry operations without overload.

Nominal Supply Voltage:

5 V - Maintains stable performance within standard voltage levels.

No. of DMA Channels:

2 - Facilitates efficient data transfer between peripherals and memory.

Terminal Pitch:

0.65 mm - Allows for precise and secure PCB mounting.

Format:

FLOATING POINT - Enables high-precision calculations in mathematical operations.

Moisture Sensitivity Level (MSL):

4 - Resists moisture and ensures component durability.

Low Power Mode:

YES - Offers energy-saving options for extended battery life.

Barrel Shifter:

YES - Facilitates efficient data manipulation and shifting operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C32PCM50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

2

No. of External Interrupts:

4

No. of Serial I/Os:

1

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

425 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TMS320C32PCM50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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