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TMS320C30GEL50

Texas Instruments

TMS320C30GEL50 by Texas Instruments

TMS320C30GEL50 by Texas Instruments is a 32-bit DSP with 5V supply, 50MHz clock freq, and 1024 RAM words. Ideal for digital signal processing applications due to its 32-bit data RAM width, 24-bit address bus width, and MROM programmability.

Median Price

$690.465

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 317 parts In-Stock

1+ parts

$658.280

100+ parts

$618.780

1k+ parts

$579.290

10k+ parts

-

317

$658.280

$618.780

$579.290

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DigiKey

USA . 319 parts In-Stock

1+ parts

$722.650

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-

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319

$722.650

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$620.160

100+ parts

-

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1,000

$620.160

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Digiode

USA . 782 parts In-Stock

1+ parts

$660.117

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782

$660.117

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Vyrian

USA . 7,705 parts In-Stock

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-

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7,705

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Distributors (Availability)

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$9.561

100+ parts

-

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766

$9.561

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Corohmni

South Africa . 1,051 parts In-Stock

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$20.375

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1,051

$20.375

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Parana Technologies

USA . 1,004 parts In-Stock

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$52.800

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-

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1,004

$52.800

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DigiPath Technology Company

USA . 220 parts In-Stock

1+ parts

$58.139

100+ parts

$53.488

1k+ parts

-

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220

$58.139

$53.488

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IDEA Electronic Components Group

UK . 1,193 parts In-Stock

1+ parts

$59.326

100+ parts

$56.360

1k+ parts

$53.393

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-

1,193

$59.326

$56.360

$53.393

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ChromeModa Solutions

Germany . 131 parts In-Stock

1+ parts

$59.326

100+ parts

$48.647

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131

$59.326

$48.647

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Ampacity Inc.

Singapore . 319 parts In-Stock

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$590.630

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319

$590.630

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Continental Prestige Electronics

USA . 5,062 parts In-Stock

1+ parts

$619.550

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$607.159

5,062

$619.550

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-

$607.159

Argo Parts USA

USA . 1,418 parts In-Stock

1+ parts

$619.550

100+ parts

$613.354

1k+ parts

$607.159

10k+ parts

$600.963

1,418

$619.550

$613.354

$607.159

$600.963

Netroflash

USA . 500 parts In-Stock

1+ parts

$620.160

100+ parts

$607.757

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500

$620.160

$607.757

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Corphita

USA . 2,721 parts In-Stock

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$625.374

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2,721

$625.374

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A-Z Elektronik GmbH

Germany . 968 parts In-Stock

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968

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Perfect Parts

USA . 560 parts In-Stock

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560

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Kepictronics

USA . 550 parts In-Stock

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550

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Microchip USA

USA . 462 parts In-Stock

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462

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Overview

Unlock the power of cutting-edge technology with the TMS320C30GEL50 by Texas Instruments. As a leader in the industry of Digital Signal Processors, Texas Instruments guarantees top-notch quality and reliability. Whether you're working on audio processing, telecommunications, or control systems, this product offers unmatched value and performance. With a maximum clock frequency of 50 MHz and 1024 RAM words, the TMS320C30GEL50 is the perfect solution for all your DSP needs. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides good thermal conductivity and protection, ensuring durability and reliability of the product.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage, offering flexibility and reliability in various operating conditions.

On Chip Data RAM Width: 32

Wide data RAM width enhances processing speed and efficiency for handling complex signals and calculations.

Address Bus Width: 24

The wider address bus width allows for larger memory address space, enabling handling of more data and instructions.

Package Shape: SQUARE

Square shape aids in efficient mounting and utilization of space on a circuit board.

Bit Size: 32

With a 32-bit size, the processor can handle larger chunks of data at a time, improving performance and accuracy.

Power Supplies (V): 5

Operates at a standard voltage value, ensuring compatibility with various power sources and ease of integration.

No. of Terminals: 181

Having numerous terminals allows for versatile connectivity options and interfacing with other components.

Package Style (Meter): GRID ARRAY

Grid array package style simplifies soldering and assembly processes, saving time and effort during product development.

Minimum Supply Voltage: 4.75 V

Supports a low minimum supply voltage, making the product suitable for applications with strict power requirements.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring reliable performance in harsh environments.

No. of External Interrupts: 4

Offers multiple external interrupt options, allowing the processor to respond quickly to external signals and events.

Minimum Operating Temperature: 0 °C

Can function in low-temperature conditions, making it suitable for a wide range of operating environments.

Terminal Position: PERPENDICULAR

Perpendicular terminal position facilitates easy insertion and removal of the processor during installation or maintenance.

Maximum Seated Height: 6.22 mm

Compact seated height enables the product to be used in space-constrained applications without compromising performance.

RAM Words: 1024

Having a large number of RAM words allows for efficient storage and manipulation of data during processing tasks.

Width: 39 mm

Compact width dimension facilitates easy integration into circuit board layouts with limited space availability.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfer between the processor and external devices.

Maximum Clock Frequency: 50 MHz

Capable of operating at a high clock frequency, ensuring swift execution of instructions and signal processing tasks.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the processor, optimizing overall performance.

Length: 39 mm

Optimal length dimension for easy placement and routing on circuit boards, improving overall design flexibility.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral capabilities enhances the versatility and functionality of the product.

No. of Timers: 2

Multiple timer options allow for precise timing control and synchronization of tasks in signal processing applications.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and reliable performance in various operating conditions.

Terminal Form: PIN/PEG

PIN/PEG terminal form simplifies connectivity and soldering processes, enhancing ease of use and reliability.

Maximum Supply Current: 600 mA

Capable of handling high supply currents, making the product suitable for applications with higher power demands.

Nominal Supply Voltage: 5 V

Operating at a standard nominal voltage simplifies power supply design and compatibility with existing systems.

No. of Serial I/Os: 2

Multiple serial I/O options enable communication with external devices, expanding connectivity and data transfer capabilities.

ROM Programmability: MROM

MROM programmability ensures secure and reliable storage of essential program instructions, enhancing data integrity and system operation.

Terminal Pitch: 2.54 mm

Optimal terminal pitch allows for easy integration into standard PCB layouts and facilitates efficient soldering and assembly processes.

Format: FLOATING POINT

Supports floating-point arithmetic, enabling precise and accurate calculations for a wide range of signal processing applications.

Barrel Shifter: YES

Inclusion of a barrel shifter enhances data manipulation capabilities, enabling efficient shifting and rotation operations for complex algorithms.

On Chip Program ROM Width: 32

Wide program ROM width allows for storing a large number of program instructions, facilitating complex signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C30GEL50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Length:

39 mm

Low Power Mode:

NO

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

2

No. of Terminals:

181

No. of Timers:

2

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181M,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Programmability:

MROM

Maximum Seated Height:

6.22 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

39 mm

Peripheral IC Type:

Trade Compliance

TMS320C30GEL50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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