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TMS320C25FNLR

Texas Instruments

TMS320C25FNLR by Texas Instruments

TMS320C25FNLR by Texas Instruments is a 16-bit DSP with 40.96 MHz clock frequency, 544 RAM words, and 16-bit data RAM width. Ideal for digital signal processing applications requiring low power mode, it operates b/w 0-70°C with a supply voltage range of 4.75-5.25 V.

Median Price

$43.099

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 368 parts In-Stock

1+ parts

-

100+ parts

$38.310

1k+ parts

$34.280

10k+ parts

$32.260

368

-

$38.310

$34.280

$32.260

DigiKey

USA . 368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

368

-

-

-

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Verical

USA . 368 parts In-Stock

1+ parts

-

100+ parts

$47.888

1k+ parts

$42.850

10k+ parts

$40.325

368

-

$47.888

$42.850

$40.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,240 parts In-Stock

1+ parts

$38.513

100+ parts

-

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4,240

$38.513

-

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Vyrian

USA . 7,133 parts In-Stock

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7,133

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Holdelec - ElecDif-Pro

France . 2,000 parts In-Stock

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2,000

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ComSIT Distribution GmbH

Germany . 1,030 parts In-Stock

1+ parts

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1,030

-

-

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ComSIT USA

USA . 1,030 parts In-Stock

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1,030

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-

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Chip Stock

USA . 610 parts In-Stock

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610

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LIBRA Elektronik GmbH

Germany . 472 parts In-Stock

1+ parts

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472

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Bristol Electronics

USA . 253 parts In-Stock

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253

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PC Components Company LLC

USA . 250 parts In-Stock

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250

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A&K Electronics

USA . 150 parts In-Stock

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150

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Rotakorn

Sweden . 150 parts In-Stock

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150

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ACDS - Activité Composants Distribution Service

France . 46 parts In-Stock

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46

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 240 parts In-Stock

1+ parts

$27.953

100+ parts

-

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240

$27.953

-

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Corphita

USA . 1,466 parts In-Stock

1+ parts

$36.486

100+ parts

-

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1,466

$36.486

-

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Parana Technologies

USA . 1,674 parts In-Stock

1+ parts

$46.672

100+ parts

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1,674

$46.672

-

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DigiPath Technology Company

USA . 1,452 parts In-Stock

1+ parts

$51.391

100+ parts

$47.280

1k+ parts

-

10k+ parts

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1,452

$51.391

$47.280

-

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ChromeModa Solutions

Germany . 479 parts In-Stock

1+ parts

$52.440

100+ parts

$43.001

1k+ parts

-

10k+ parts

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479

$52.440

$43.001

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IDEA Electronic Components Group

UK . 26 parts In-Stock

1+ parts

$52.440

100+ parts

$49.818

1k+ parts

$47.196

10k+ parts

-

26

$52.440

$49.818

$47.196

-

Microchip USA

USA . 134 parts In-Stock

1+ parts

$111.800

100+ parts

$110.830

1k+ parts

$110.830

10k+ parts

$109.860

134

$111.800

$110.830

$110.830

$109.860

A-Z Elektronik GmbH

Germany . 4,895 parts In-Stock

1+ parts

-

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4,895

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 250 parts In-Stock

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250

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Overview

Unlock the power of high-quality digital signal processing with the TMS320C25FNLR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a state-of-the-art DSP that offers unparalleled value and benefits. Ideal for a wide range of applications, this chip carrier package delivers exceptional performance and reliability. Experience the advantages of the TMS320C25FNLR and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and good heat dissipation, making the product reliable for long-term use.

Maximum Supply Voltage: 5.25 V

Allows for flexibility in power supply options.

Bit Size: 16

Offers high processing power and accuracy for digital signal processing tasks.

Maximum Clock Frequency: 40.96 MHz

Enables fast and efficient signal processing operations.

Technology: CMOS

Utilizes low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C25FNLR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

PID CONTROL; 256 WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40.96 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Serial I/Os:

1

No. of Terminals:

68

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

MROM

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

185 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

TMS320C25FNLR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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