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TMS320BC57SPGE80

Texas Instruments

TMS320BC57SPGE80 by Texas Instruments

TMS320BC57SPGE80 by Texas Instruments is a 16-bit DSP with 512 RAM words, operating at 80 MHz. It features a low power mode and barrel shifter, suitable for digital signal processing applications requiring high-speed data processing in commercial temperature environments. The package style is flatpack with a terminal pitch of 0.5 mm.

Median Price

$58.940

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 118 parts In-Stock

1+ parts

-

100+ parts

$58.940

1k+ parts

$52.730

10k+ parts

$49.630

118

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$58.940

$52.730

$49.630

DigiKey

USA . 118 parts In-Stock

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118

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Verical

USA . 49 parts In-Stock

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$73.675

1k+ parts

$65.912

10k+ parts

$62.038

49

-

$73.675

$65.912

$62.038

Arrow

USA . 10 parts In-Stock

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$10.572

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$10.572

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Distributors (In-Stock)

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Digiode

USA . 4,866 parts In-Stock

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$62.216

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$62.216

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DigiKey Marketplace

USA . 118 parts In-Stock

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$68.110

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Vyrian

USA . 7,753 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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ComSIT Distribution GmbH

Germany . 8 parts In-Stock

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Odi Ramu Company

Canada . 8 parts In-Stock

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Prism Electronics

USA . 6 parts In-Stock

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Inventory MP

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Flex Direct, LLC

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Distributors (Availability)

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Corohmni

South Africa . 3,036 parts In-Stock

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$25.149

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3,036

$25.149

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Parana Technologies

USA . 328 parts In-Stock

1+ parts

$38.538

100+ parts

$3,578.828

1k+ parts

$34.684

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328

$38.538

$3,578.828

$34.684

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DigiPath Technology Company

USA . 1,111 parts In-Stock

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$42.435

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$42.435

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ChromeModa Solutions

Germany . 5,047 parts In-Stock

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$43.301

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$35.507

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5,047

$43.301

$35.507

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

1+ parts

$43.301

100+ parts

$41.136

1k+ parts

$38.971

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1,199

$43.301

$41.136

$38.971

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$48.155

100+ parts

$43.821

1k+ parts

$39.487

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$48.155

$43.821

$39.487

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Corphita

USA . 4,596 parts In-Stock

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$58.941

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$58.941

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Component Stockers USA

USA . 154 parts In-Stock

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$68.040

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$63.950

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Microchip USA

USA . 431 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Perfect Parts

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Overview

Experience the power of cutting-edge technology with the Texas Instruments TMS320BC57SPGE80 Digital Signal Processor. Crafted with precision and innovation, this high-quality product offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, the TMS320BC57SPGE80 delivers exceptional value and benefits, making it the ideal choice for customers seeking top-tier solutions in the digital signal processing realm. Trust in Texas Instruments to provide you with the tools you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the DSP, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and enabling mass production.

Maximum Supply Voltage: 5.25 V

Operating at a maximum supply voltage of 5.25 V ensures stable performance and prevents damage to the DSP during power fluctuations.

Address Bus Width: 16

A wider address bus width of 16 allows for efficient communication between the DSP and external memory, enabling faster data processing.

Package Shape: SQUARE

The square package shape provides uniform distribution of components and facilitates easy integration into circuit designs.

Bit Size: 16

A bit size of 16 enables the DSP to process data in larger chunks, improving efficiency and speed of calculations.

Power Supplies (V): 5

Operating at a power supply voltage of 5 V ensures compatibility with standard power sources, making it easy to integrate the DSP into various systems.

No. of Terminals: 144

Having 144 terminals allows for multiple connectivity options, enabling the DSP to interface with various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style reduces the overall size of the DSP, saving space on the circuit board and enabling compact designs.

Minimum Supply Voltage: 4.75 V

Operating at a minimum supply voltage of 4.75 V ensures stable performance even during low power conditions, enhancing the reliability of the DSP.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the DSP can withstand high-temperature environments without risking overheating or performance degradation.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures the DSP remains functional even in cold environments, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and improves conductivity, ensuring reliable connections for optimal performance.

Terminal Position: QUAD

Having terminals in quad position enables convenient soldering and assembly onto the circuit board, reducing installation complexity.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6 mm ensures a compact form factor, making the DSP suitable for space-constrained applications.

RAM Words: 512

With 512 RAM words, the DSP can store and access a large amount of data quickly, facilitating efficient real-time processing and calculations.

Width: 20 mm

A width of 20 mm allows for easy integration of the DSP into standard circuit board layouts, simplifying the design process.

Boundary Scan: YES

Boundary scan capability enables the DSP to perform self-testing and diagnostics, simplifying troubleshooting and maintenance procedures.

External Data Bus Width: 16

An external data bus width of 16 allows for fast data transfer between the DSP and external devices, improving overall system performance.

Maximum Clock Frequency: 80 MHz

Operating at a maximum clock frequency of 80 MHz enables high-speed data processing and real-time calculations, making the DSP suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, preventing heat damage to the DSP.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the DSP can withstand high-temperature soldering processes without affecting its performance.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enables parallel processing and efficient data flow within the DSP, improving overall performance.

Length: 20 mm

A length of 20 mm provides a compact form factor for the DSP, allowing for flexible placement within circuit board designs.

Temperature Grade: COMMERCIAL

Designed for commercial use, the DSP can operate reliably in standard temperature conditions, making it suitable for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with other peripheral capabilities, this product offers versatile functionality for a variety of signal processing applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder connections, ensuring secure attachment to the circuit board and reducing the risk of disconnection.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for precise soldering and compact placement of the DSP on the circuit board, optimizing space utilization.

Format: FIXED POINT

Operating in fixed-point format allows for fast and efficient mathematical computations, ideal for signal processing applications that require real-time processing.

Low Power Mode: YES

Enabling low power mode helps conserve energy during idle or low processing load periods, extending battery life in portable devices and reducing overall power consumption.

Barrel Shifter: YES

Incorporating a barrel shifter allows for efficient bit-wise data manipulation and shifting operations, improving the DSP's processing capabilities for complex algorithms.

Technical Specifications

Digital Signal Processors (DSPs) TMS320BC57SPGE80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

6K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320BC57SPGE80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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