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TMS320BC51PQ80

Texas Instruments

TMS320BC51PQ80 by Texas Instruments

TMS320BC51PQ80 by Texas Instruments is a 16-bit DSP with 5V supply, 80MHz clock frequency, and 2080 RAM words. Ideal for digital signal processing applications due to its low power mode, barrel shifter feature, and boundary scan capability.

Median Price

$38.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33 parts In-Stock

1+ parts

$38.100

100+ parts

$37.340

1k+ parts

$36.580

10k+ parts

-

33

$38.100

$37.340

$36.580

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,489 parts In-Stock

1+ parts

-

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7,489

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Digiode

USA . 4,165 parts In-Stock

1+ parts

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4,165

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Bristol Electronics

USA . 64 parts In-Stock

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-

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64

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Distributors (Availability)

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AZTECH Wire

Italy . 237 parts In-Stock

1+ parts

$9.189

100+ parts

-

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237

$9.189

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One Stop Electronics

USA . 911 parts In-Stock

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$12.000

100+ parts

-

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911

$12.000

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Corohmni

South Africa . 2,420 parts In-Stock

1+ parts

$32.514

100+ parts

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2,420

$32.514

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Parana Technologies

USA . 2,210 parts In-Stock

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$63.291

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2,210

$63.291

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DigiPath Technology Company

USA . 2,012 parts In-Stock

1+ parts

$69.692

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2,012

$69.692

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ChromeModa Solutions

Germany . 4,934 parts In-Stock

1+ parts

$71.114

100+ parts

$58.313

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4,934

$71.114

$58.313

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IDEA Electronic Components Group

UK . 212 parts In-Stock

1+ parts

$71.114

100+ parts

$67.558

1k+ parts

$64.003

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212

$71.114

$67.558

$64.003

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

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1,000

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Corphita

USA . 366 parts In-Stock

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366

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Microchip USA

USA . 125 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the TMS320BC51PQ80 by Texas Instruments. As a leader in DSP technology, Texas Instruments delivers cutting-edge solutions that meet industry standards for quality and performance. The TMS320BC51PQ80 is ideal for applications in telecommunications, audio processing, automotive systems, and more. With its advanced features and reliable design, this DSP offers customers unparalleled value, efficiency, and versatility. Upgrade your systems today with the TMS320BC51PQ80 and experience the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature makes it easier to integrate this DSP into electronic devices and PCBs.

Maximum Supply Voltage: 5.25 V

Having a maximum supply voltage of 5.25 V allows for a wider range of input voltages, increasing compatibility with various systems.

Address Bus Width: 16

A wider address bus width of 16 allows for efficient data processing and handling of larger memory addresses.

Bit Size: 16

With a bit size of 16, this DSP can handle complex calculations and digital signal processing tasks effectively.

Power Supplies (V): 5

Operating at a power supply of 5V provides a standard and stable power source for the DSP.

No. of Terminals: 132

Having 132 terminals allows for multiple connections and interfaces, enhancing the versatility of the DSP.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage of 4.75 V ensures that the DSP can still operate safely even with slightly lower input voltages.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C makes the DSP suitable for use in various environments and conditions.

Minimum Operating Temperature: 0 °C

Being able to operate at a minimum temperature of 0°C ensures reliable performance even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

The quad terminal position allows for secure mounting and stable connections when integrating the DSP into a system.

RAM Words: 2080

With 2080 RAM words, the DSP has sufficient memory for storing and accessing data during processing tasks.

Width: 24.13 mm

The compact width of 24.13 mm makes the DSP suitable for applications where space is limited.

Boundary Scan: YES

Having boundary scan capability simplifies testing and debugging of the DSP during development and production phases.

External Data Bus Width: 16

An external data bus width of 16 enables fast and efficient data transfer between the DSP and external devices.

Maximum Clock Frequency: 80 MHz

Operating at a maximum clock frequency of 80 MHz allows the DSP to handle higher data processing speeds and real-time applications.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture enables parallel processing and enhances the overall performance of the DSP.

Length: 24.13 mm

The compact length of 24.13 mm makes the DSP suitable for applications where space is limited.

Temperature Grade: COMMERCIAL

Being commercially graded ensures that the DSP meets industry standards for reliability and performance in commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type being a digital signal processor enhances the product's capabilities for processing and handling digital signals efficiently.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form factor facilitates easy soldering and mounting of the DSP onto a PCB or electronic device.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures consistent and reliable power delivery to the DSP.

Terminal Pitch: 0.635 mm

With a small terminal pitch of 0.635 mm, the DSP can accommodate more terminals in a compact space, enhancing connectivity options.

Format: FIXED POINT

Being in a fixed-point format offers predictable and consistent precision for numerical calculations and digital signal processing tasks.

Moisture Sensitivity Level (MSL): 4

With an MSL of 4, the DSP can withstand a higher level of moisture exposure during handling and storage.

Low Power Mode: YES

The low power mode feature allows the DSP to operate efficiently while conserving energy, making it suitable for battery-powered devices.

Barrel Shifter: YES

Having a barrel shifter enables efficient and fast shifting of bits in the DSP during data processing tasks, improving performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320BC51PQ80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2080

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320BC51PQ80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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