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TMDS361PAG

Texas Instruments

TMDS361PAG by Texas Instruments

TMDS361PAG by Texas Instruments is a 64-terminal IC with 3.3V power supply, suitable for consumer circuits. It features a flatpack package style, nickel palladium gold finish, and operates b/w 0-70°C. Ideal for applications requiring a compact, high-performance solution in commercial temperature environments.

Median Price

$1.762

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$1.580

1k+ parts

$1.410

10k+ parts

$1.330

480

-

$1.580

$1.410

$1.330

DigiKey

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.830

10k+ parts

-

480

-

-

$1.830

-

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.762

10k+ parts

$1.663

480

-

-

$1.762

$1.663

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,820 parts In-Stock

1+ parts

$1.672

100+ parts

-

1k+ parts

-

10k+ parts

-

4,820

$1.672

-

-

-

Vyrian

USA . 6,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,242

-

-

-

-

DigiKey Marketplace

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,150 parts In-Stock

1+ parts

$1.303

100+ parts

-

1k+ parts

$2.052

10k+ parts

-

2,150

$1.303

-

$2.052

-

ChromeModa Solutions

Germany . 3,293 parts In-Stock

1+ parts

$1.464

100+ parts

$1.200

1k+ parts

-

10k+ parts

-

3,293

$1.464

$1.200

-

-

IDEA Electronic Components Group

UK . 2,082 parts In-Stock

1+ parts

$1.464

100+ parts

-

1k+ parts

$1.318

10k+ parts

-

2,082

$1.464

-

$1.318

-

Corphita

USA . 3,115 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

-

3,115

$1.584

-

-

-

A-Z Elektronik GmbH

Germany . 6,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,887

-

-

-

-

Kepictronics

USA . 1,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,577

-

-

-

-

Microchip USA

USA . 304 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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304

-

-

-

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DigiPath Technology Company

USA . 141 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

-

10k+ parts

-

141

-

$1.320

-

-

Overview

Discover the innovative TMDS361PAG by Texas Instruments, a cutting-edge Consumer Circuit IC designed to exceed your expectations. With a sleek flatpack design and high-quality materials, this product offers optimal performance and reliability for a wide range of applications. Experience the superior value and benefits that Texas Instruments brings to the table with this versatile and efficient solution. Upgrade your projects with the TMDS361PAG and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape is compact and helps in efficient utilization of board space.

Power Supplies (V): 3.3

The 3.3V power supply requirement is common and widely available, ensuring compatibility with a variety of systems.

No. of Terminals: 64

The high number of terminals enables the IC to support complex circuit functionalities.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connections to the circuit board.

Width: 10 mm

The compact width of 10mm contributes to the overall space-saving design of the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures compatibility with lead-free soldering processes.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard operating conditions in commercial applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and space-efficient layout on the board.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the IC can withstand moderate humidity levels during storage and assembly processes.

Technical Specifications

Other Function Consumer ICs TMDS361PAG attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

216 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TMDS361PAG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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