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TLV5734PAGG4

Texas Instruments

TLV5734PAGG4 by Texas Instruments

TLV5734PAGG4 by Texas Instruments is an 8-bit ADC with 3 analog in channels, 30 MHz sample rate, and 0.293% linearity error. Ideal for applications requiring fast conversion times and high precision measurements. Package style: Flatpack, thin profile, fine pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,775 parts In-Stock

1+ parts

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9,775

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Digiode

USA . 4,468 parts In-Stock

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4,468

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Distributors (Availability)

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AZTECH Wire

Italy . 9,775 parts In-Stock

1+ parts

$2.950

100+ parts

$2.830

1k+ parts

$2.780

10k+ parts

$2.720

9,775

$2.950

$2.830

$2.780

$2.720

One Stop Electronics

USA . 1,324 parts In-Stock

1+ parts

$9.000

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1,324

$9.000

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Parana Technologies

USA . 807 parts In-Stock

1+ parts

$18.650

100+ parts

$1,731.931

1k+ parts

$16.785

10k+ parts

-

807

$18.650

$1,731.931

$16.785

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DigiPath Technology Company

USA . 1,744 parts In-Stock

1+ parts

$20.536

100+ parts

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1,744

$20.536

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ChromeModa Solutions

Germany . 2,450 parts In-Stock

1+ parts

$20.955

100+ parts

$17.183

1k+ parts

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10k+ parts

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2,450

$20.955

$17.183

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IDEA Electronic Components Group

UK . 2,134 parts In-Stock

1+ parts

$20.955

100+ parts

$19.907

1k+ parts

$18.860

10k+ parts

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2,134

$20.955

$19.907

$18.860

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Component Stockers USA

USA . 387 parts In-Stock

1+ parts

$99.990

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387

$99.990

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Corphita

USA . 2,403 parts In-Stock

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2,403

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Microchip USA

USA . 140 parts In-Stock

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140

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Overview

Unlock a world of precision and efficiency with the TLV5734PAGG4 by Texas Instruments. As a trusted leader in analog-to-digital converters, Texas Instruments delivers top-quality products that meet the highest industry standards. This versatile ADC offers unparalleled performance and reliability, making it ideal for a wide range of applications. Experience the value and benefits of seamless conversion, accurate data acquisition, and superior signal processing with the TLV5734PAGG4. Elevate your projects to new heights with Texas Instruments at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

No. of Analog In Channels: 3

Having multiple analog input channels allows for more versatile input options and data collection.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

No. of Bits: 8

With 8 bits, this ADC can provide a resolution of 256 different levels, allowing for detailed and accurate conversion.

Maximum Linearity Error (EL): 0.293%

The low linearity error ensures that the output closely matches the input signal, enhancing accuracy.

Power Supplies (V): 3.3

Operating at 3.3V makes this ADC compatible with standard power supplies, reducing the need for additional components.

No. of Terminals: 64

Having 64 terminals allows for multiple connection options and flexibility in circuit design.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers a compact and space-saving design for efficient use in limited spaces.

Maximum Operating Temperature: 75 °C

The high operating temperature range enables the ADC to function reliably in various environments.

Minimum Operating Temperature: -20 °C

The low operating temperature ensures the ADC can operate in colder conditions without performance issues.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection for optimal performance.

Maximum Conversion Time: 0.03 us

The fast conversion time allows for quick and efficient data processing, ideal for real-time applications.

Maximum Seated Height: 1.2 mm

With a low seated height, this ADC can fit into compact devices and tight spaces.

Width: 10 mm

The compact width makes it easy to integrate this ADC into various electronic setups.

Length: 10 mm

The small length allows for a space-efficient design and easy placement on circuit boards.

Temperature Grade: COMMERCIAL EXTENDED

Designed for commercial extended temperature ranges, this ADC is suitable for a wide range of industrial applications.

Maximum Analog Input Voltage: 1 V

Supporting up to 1V analog input voltage, this ADC can handle a wide range of signal levels for versatile use.

Sample Rate: 30 MHz

With a high sample rate of 30 MHz, this ADC can accurately capture and convert fast-changing input signals.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this ADC energy-efficient and fast.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easy soldering for reliable connections.

Converter Type: ADC, PROPRIETARY METHOD

Using a proprietary conversion method ensures unique and optimized performance, ideal for specific applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V allows for compatibility with standard power sources.

Output Bit Code: BINARY

Outputting data in binary format enables easy processing and compatibility with digital systems.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, this ADC offers high-density integration and precise connections.

Minimum Analog Input Voltage: 0 V

Supporting a minimum analog input voltage of 0V, this ADC can accurately detect even the smallest input signals.

Output Format: PARALLEL, 8 BITS

Providing output in parallel format with 8 bits ensures efficient data transfer and compatibility with various systems.

Technical Specifications

Analog-to-Digital Converters TLV5734PAGG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

3

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.293 %

Sample Rate:

30 MHz

Maximum Conversion Time:

30 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

1 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

75 °C (167 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP64,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

Qualified:

No

Trade Compliance

TLV5734PAGG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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