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TLV5734PAG

Texas Instruments

TLV5734PAG by Texas Instruments

TLV5734PAG by Texas Instruments is an 8-bit ADC with 3 analog in channels, 30 MHz sample rate, and 0.293% max linearity error. Ideal for applications requiring fast conversion times and high precision measurements. Package style: Flatpack, thin profile, fine pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,499 parts In-Stock

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6,499

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Digiode

USA . 1,410 parts In-Stock

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1,410

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Cyclops Electronics Ltd

UK . 240 parts In-Stock

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240

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Bristol Electronics

USA . 240 parts In-Stock

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240

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Distributors (Availability)

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One Stop Electronics

USA . 1,022 parts In-Stock

1+ parts

$4.000

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1,022

$4.000

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Parana Technologies

USA . 1,432 parts In-Stock

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$7.681

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$8.206

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1,432

$7.681

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$8.206

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DigiPath Technology Company

USA . 1,748 parts In-Stock

1+ parts

$8.457

100+ parts

$7.781

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1,748

$8.457

$7.781

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ChromeModa Solutions

Germany . 473 parts In-Stock

1+ parts

$8.630

100+ parts

$7.077

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473

$8.630

$7.077

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IDEA Electronic Components Group

UK . 420 parts In-Stock

1+ parts

$8.630

100+ parts

$8.198

1k+ parts

$7.767

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420

$8.630

$8.198

$7.767

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AZTECH Wire

Italy . 531 parts In-Stock

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$19.425

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531

$19.425

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A-Z Elektronik GmbH

Germany . 4,763 parts In-Stock

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4,763

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Corphita

USA . 960 parts In-Stock

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960

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Microchip USA

USA . 270 parts In-Stock

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270

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Perfect Parts

USA . 269 parts In-Stock

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269

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Overview

Discover the TLV5734PAG by Texas Instruments, a top-of-the-line Analog-to-Digital Converter that offers unparalleled quality and precision. With a commitment to excellence, Texas Instruments ensures that this product delivers reliable performance across a variety of applications. From industrial automation to consumer electronics, the TLV5734PAG provides value and versatility to customers seeking high-quality conversion solutions. Upgrade your projects with this cutting-edge converter and experience the innovation that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various environments and applications.

No. of Analog In Channels: 3

Having multiple analog input channels allows for greater flexibility in connecting and monitoring different signals simultaneously.

Surface Mount: YES

Surface mounting capability enables easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Bits: 8

With 8 bits of resolution, the converter can provide accurate digital representation of analog signals.

Maximum Linearity Error (EL): 0.293 %

Low linearity error ensures precision in analog-to-digital conversion, resulting in accurate and reliable data.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with common power sources and ensures power efficiency.

No. of Terminals: 64

Having multiple terminals enables easy connections and interfaces with other components in the system.

Maximum Conversion Time: 0.03 us

Fast conversion time ensures real-time processing of analog signals, making the product suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters TLV5734PAG attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

3

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.293 %

Sample Rate:

30 MHz

Maximum Conversion Time:

30 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

1 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

75 °C (167 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP64,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

Qualified:

No

Trade Compliance

TLV5734PAG Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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