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TLV5623IDGKRG4

Texas Instruments

TLV5623IDGKRG4 by Texas Instruments

TLV5623IDGKRG4 by Texas Instruments is an 8-bit D/A converter with a max analog output voltage of 5.4V and settling time of 20us. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85°C, with a low supply current of 1.35mA for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,771 parts In-Stock

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Digiode

USA . 2,595 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 828 parts In-Stock

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$11.351

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828

$11.351

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Parana Technologies

USA . 299 parts In-Stock

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$18.781

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$18.867

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299

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$18.867

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DigiPath Technology Company

USA . 1,097 parts In-Stock

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$20.680

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$20.680

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ChromeModa Solutions

Germany . 4,725 parts In-Stock

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$21.102

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$17.304

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IDEA Electronic Components Group

UK . 2,132 parts In-Stock

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$21.102

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$20.047

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$18.992

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$21.102

$20.047

$18.992

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One Stop Electronics

USA . 251 parts In-Stock

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$38.000

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$38.000

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A-Z Elektronik GmbH

Germany . 6,377 parts In-Stock

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Corphita

USA . 4,212 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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Microchip USA

USA . 2,538 parts In-Stock

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Overview

Experience superior performance with the TLV5623IDGKRG4 by Texas Instruments, a leading manufacturer in the industry. This digital-to-analog converter offers precision and reliability, making it ideal for a wide range of applications. Whether you're designing audio equipment, industrial automation systems, or communication devices, this product delivers exceptional value with its fast settling time and high linearity. Trust Texas Instruments to provide you with the quality and innovation you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.4 V

Allows for a high maximum analog output voltage, providing flexibility and options for the user.

No. of Bits: 8

With 8 bits, this DAC offers good resolution for converting digital signals to analog, leading to accurate output signals.

Maximum Settling Time: 20 us

Fast settling time ensures quick and stable output response, making it suitable for applications where speed is critical.

Power Supplies (V): 3/5

Supports multiple power supply options, making it versatile and compatible with different systems.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for industrial applications where ruggedness is required.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Digital-to-Analog Converters TLV5623IDGKRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

9 µs

Maximum Supply Current:

1.35 mA

Maximum Settling Time:

20 µs

Sample Rate:

102 kHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.4 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5623IDGKRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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