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TLV1570CPWRG4

Texas Instruments

TLV1570CPWRG4 by Texas Instruments

TLV1570CPWRG4 by Texas Instruments is a 10-bit ADC with 8 analog in channels, operating at 1.25 MHz sample rate and 0.0977% linearity error. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature grade environments.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,534 parts In-Stock

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Digiode

USA . 1,229 parts In-Stock

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AZTECH Wire

Italy . 415 parts In-Stock

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$11.084

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One Stop Electronics

USA . 871 parts In-Stock

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Parana Technologies

USA . 1,495 parts In-Stock

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DigiPath Technology Company

USA . 1,285 parts In-Stock

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$23.586

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ChromeModa Solutions

Germany . 6,495 parts In-Stock

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$26.160

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$21.451

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IDEA Electronic Components Group

UK . 886 parts In-Stock

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$26.160

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$24.852

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$23.544

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Component Stockers USA

USA . 263 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Kepictronics

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Speed Components Ltd (Excess)

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Overview

Experience precision and reliability with the Texas Instruments TLV1570CPWRG4 Analog-to-Digital Converter. Manufactured by industry leader Texas Instruments, this high-quality converter offers unparalleled performance in a wide range of applications. With 10 bits of resolution and a maximum linearity error of 0.0977%, this converter provides accurate and fast conversion rates. Whether you're designing industrial automation systems or medical devices, the TLV1570CPWRG4 delivers exceptional value and benefits to meet your needs. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the converter.

No. of Analog In Channels: 8

Allows for multiple analog inputs to be converted simultaneously, making it suitable for applications that require monitoring of multiple signals.

Surface Mount: YES

Facilitates easy and secure mounting on circuit boards, enabling efficient integration into electronic systems.

No. of Bits: 10

Offers high resolution conversion for accurate representation of analog signals in digital form.

Maximum Linearity Error (EL): 0.0977%

Ensures high accuracy in signal conversion, making it reliable for precision measurement applications.

Power Supplies (V): 3/5

Provides flexibility in power requirements, allowing the converter to be used in a variety of voltage configurations.

No. of Terminals: 20

Enables easy connection to external circuitry and components, facilitating integration into larger systems.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Offers a compact and space-saving design, ideal for applications where size constraints are a concern.

Technical Specifications

Analog-to-Digital Converters TLV1570CPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

1.25 MHz

Hold Mode:

Sample

Maximum Conversion Time:

1 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

8.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1570CPWRG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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