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TLV1543CDBG4

Texas Instruments

TLV1543CDBG4 by Texas Instruments

TLV1543CDBG4 by Texas Instruments is a 10-bit ADC with 11 analog in channels, 0.0977% max linearity error, and 21us conversion time. Ideal for commercial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,265 parts In-Stock

1+ parts

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8,265

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Digiode

USA . 3,943 parts In-Stock

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3,943

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LIBRA Elektronik GmbH

Germany . 26 parts In-Stock

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26

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 343 parts In-Stock

1+ parts

$18.821

100+ parts

-

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343

$18.821

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Parana Technologies

USA . 1,082 parts In-Stock

1+ parts

$22.631

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$23.290

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1,082

$22.631

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$23.290

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DigiPath Technology Company

USA . 1,648 parts In-Stock

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$24.919

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1,648

$24.919

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IDEA Electronic Components Group

UK . 817 parts In-Stock

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$25.428

100+ parts

$24.157

1k+ parts

$22.885

10k+ parts

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817

$25.428

$24.157

$22.885

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ChromeModa Solutions

Germany . 729 parts In-Stock

1+ parts

$25.428

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$20.851

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729

$25.428

$20.851

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One Stop Electronics

USA . 454 parts In-Stock

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$30.000

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454

$30.000

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Kepictronics

USA . 2,550 parts In-Stock

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2,550

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Corphita

USA . 648 parts In-Stock

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648

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Overview

Unlock the power of precision with the TLV1543CDBG4 Analog-to-Digital Converter by Texas Instruments. Designed with top-notch quality and cutting-edge technology, this converter offers exceptional accuracy and reliability for a wide range of applications. Whether you're working on industrial automation, medical devices, or consumer electronics, this compact yet powerful device delivers unmatched performance. Experience seamless integration, high-speed conversion, and low power consumption with the TLV1543CDBG4. Elevate your projects to the next level with this innovative solution from a trusted leader in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

No. of Analog In Channels: 11

Allows for multiple input signals to be converted simultaneously, increasing efficiency in data acquisition.

Surface Mount: YES

Enables easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Bits: 10

Provides a high level of resolution in converting analog signals to digital, ensuring accurate data acquisition.

Maximum Linearity Error (EL): 0.0977 %

Ensures precise conversion of analog signals with minimal error, improving the overall accuracy of the data.

Technology: CMOS

Utilizes low power consumption and provides high speed and accuracy in analog-to-digital conversion, enhancing performance.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Offers a fast conversion time of 21 us with high resolution, making it suitable for applications requiring quick and accurate data acquisition.

Technical Specifications

Analog-to-Digital Converters TLV1543CDBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1543CDBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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