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TLV1543CDWRG4

Texas Instruments

TLV1543CDWRG4 by Texas Instruments

TLV1543CDWRG4 by Texas Instruments is a 10-bit ADC with 11 analog in channels, 0.0977% max linearity error, and 21us conversion time. Ideal for commercial applications requiring small outline package style, it operates at temperatures from 0 to 70°C with supply voltages of 3.3/5V.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,037 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Digiode

USA . 240 parts In-Stock

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AZTECH Wire

Italy . 454 parts In-Stock

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$8.017

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Parana Technologies

USA . 598 parts In-Stock

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$8.718

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DigiPath Technology Company

USA . 1,084 parts In-Stock

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$9.599

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$8.831

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ChromeModa Solutions

Germany . 3,440 parts In-Stock

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IDEA Electronic Components Group

UK . 1,188 parts In-Stock

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$8.816

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Ampacity Inc.

Singapore . 592 parts In-Stock

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Corohmni

South Africa . 767 parts In-Stock

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One Stop Electronics

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Component Stockers USA

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Authorized Procurement Solutions

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Advanced Electronics

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Overview

Unlock the potential of your analog-to-digital conversion needs with the TLV1543CDWRG4 by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments offers a wide range of applications for their Analog-to-Digital Converters, including precision measurement and data acquisition systems. Experience the seamless integration, reliability, and efficiency that the TLV1543CDWRG4 provides, making it the perfect solution for your next project. Elevate your designs with Texas Instruments and discover the difference in performance and accuracy today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the converter.

No. of Analog In Channels: 11

Allows for multiple input signals to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Easy to install and saves space on the circuit board.

No. of Bits: 10

Provides high resolution for accurate digital conversion of analog signals.

Power Supplies (V): 3.3/5

Offers flexibility in power options for different applications.

No. of Terminals: 20

Sufficient terminals for connecting various components in the circuit.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, making it suitable for different environments.

Maximum Conversion Time: 21 us

Provides fast conversion speeds for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Output Format: SERIAL

Output in serial format allows for easy data transmission and processing.

Technical Specifications

Analog-to-Digital Converters TLV1543CDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

38 kHz

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1543CDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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