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TLV1508IPWRG4

Texas Instruments

TLV1508IPWRG4 by Texas Instruments

TLV1508IPWRG4 by Texas Instruments is a 10-bit ADC with 8 analog in channels, 0.0488% max linearity error, and 3/5 V power supplies. Ideal for industrial applications, it features a small outline package style and operates b/w -40 to 85°C. With a sample rate of 0.2 MHz, it offers binary output in serial format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,169 parts In-Stock

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6,169

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Digiode

USA . 1,165 parts In-Stock

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1,165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 502 parts In-Stock

1+ parts

$12.000

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502

$12.000

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Parana Technologies

USA . 1,256 parts In-Stock

1+ parts

$13.188

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-

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$13.692

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1,256

$13.188

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$13.692

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DigiPath Technology Company

USA . 51 parts In-Stock

1+ parts

$14.522

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51

$14.522

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ChromeModa Solutions

Germany . 6,673 parts In-Stock

1+ parts

$14.818

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$12.151

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6,673

$14.818

$12.151

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IDEA Electronic Components Group

UK . 873 parts In-Stock

1+ parts

$14.818

100+ parts

$14.077

1k+ parts

$13.336

10k+ parts

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873

$14.818

$14.077

$13.336

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AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$16.547

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357

$16.547

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Corphita

USA . 2,881 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Enhance your electronic designs with the TLV1508IPWRG4 by Texas Instruments, a top-quality Analog-to-Digital Converter offering precision and reliability. With 10 bits of resolution and 8 analog input channels, this converter is perfect for a wide range of applications in industrial settings. Its compact design and low power consumption make it a cost-effective solution for your projects. Trust Texas Instruments for cutting-edge technology and superior performance. Unlock new possibilities with the TLV1508IPWRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the analog-to-digital converter.

No. of Analog In Channels: 8

Allows for multiple analog inputs to be converted simultaneously, increasing efficiency and flexibility in data acquisition.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 10

Offers high resolution and accuracy in digitizing analog signals, ensuring precise conversion.

Maximum Linearity Error (EL): 0.0488 %

Provides high linearity, minimizing distortion and ensuring accurate representation of input signals.

Power Supplies (V): 3/5

Supports multiple power supply options, offering flexibility in system design and integration.

No. of Terminals: 20

Provides ample connectivity options for interfacing with other components, enhancing versatility in system integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-saving designs, ideal for applications with limited board space.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of temperature conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in harsh environments with extreme temperatures, enhancing durability and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides robust terminal connections that resist corrosion and ensure long-term reliability in operation.

Terminal Position: DUAL

Offers flexibility in circuit board layout and connectivity options, accommodating various design requirements.

Maximum Conversion Time: 3.86 us

Provides fast conversion rates, allowing for real-time data processing and fast response times.

Maximum Seated Height: 1.2 mm

Enables low-profile designs, suitable for compact electronic devices and applications with height constraints.

Width: 4.4 mm

Compact dimensions make it suitable for space-constrained applications, offering efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable reflow soldering process during assembly, maintaining product integrity and performance.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes, ensuring secure and durable connections during assembly.

Length: 6.5 mm

Compact form factor enables easy integration into electronic devices with limited space, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments, ensuring reliable operation in demanding conditions.

Maximum Analog Input Voltage: 5.5 V

Accommodates a wide range of analog input voltages, making it versatile for various signal processing applications.

Sample Rate: 0.2 MHz

Offers high sampling rate for capturing fast-changing analog signals accurately, ensuring detailed signal analysis.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high levels of integration, enhancing efficiency and performance.

Terminal Form: GULL WING

Facilitates easy soldering and provides secure terminal connections, ensuring reliable performance in operation.

Maximum Supply Current: 2.1 mA

Low power consumption minimizes energy usage and heat generation, suitable for battery-operated devices.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Employs successive approximation technique for high-speed and high-resolution analog-to-digital conversion, ensuring accurate data conversion.

Nominal Supply Voltage: 3.3 V

Supports common supply voltage standards, simplifying system integration and compatibility with existing circuitry.

Output Bit Code: BINARY

Produces output data in binary format, compatible with most digital systems and data processing units.

Terminal Pitch: 0.65 mm

Offers precise terminal spacing for easy soldering and compact board layout, enhancing manufacturing efficiency.

Minimum Analog Input Voltage: 0 V

Accommodates zero voltage signals for accurate analog signal processing, ensuring comprehensive signal coverage.

Output Format: SERIAL

Delivers output data in serial format, suitable for communication with microcontrollers and data processing units.

Sample and Hold/Track and Hold: SAMPLE

Supports sample-and-hold functionality for accurate signal conversion, ensuring precise data capture and processing.

Technical Specifications

Analog-to-Digital Converters TLV1508IPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.86 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

2.1 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1508IPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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