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TLV1504IDG4

Texas Instruments

TLV1504IDG4 by Texas Instruments

TLV1504IDG4 by Texas Instruments is a 10-bit ADC with 4 analog in channels, 0.0488% EL, and 3/5 V power supplies. Ideal for industrial applications, it features a sample rate of 0.2 MHz, CMOS technology, and operates b/w -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,084 parts In-Stock

1+ parts

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5,084

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Digiode

USA . 4,791 parts In-Stock

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4,791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$11.604

100+ parts

-

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729

$11.604

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Parana Technologies

USA . 13 parts In-Stock

1+ parts

$12.539

100+ parts

-

1k+ parts

$12.992

10k+ parts

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13

$12.539

-

$12.992

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ChromeModa Solutions

Germany . 3,668 parts In-Stock

1+ parts

$14.089

100+ parts

$11.553

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3,668

$14.089

$11.553

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IDEA Electronic Components Group

UK . 1,338 parts In-Stock

1+ parts

$14.089

100+ parts

$13.385

1k+ parts

$12.680

10k+ parts

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1,338

$14.089

$13.385

$12.680

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One Stop Electronics

USA . 1,613 parts In-Stock

1+ parts

$34.000

100+ parts

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1,613

$34.000

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DigiPath Technology Company

USA . 454 parts In-Stock

1+ parts

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100+ parts

$12.703

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454

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$12.703

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Corphita

USA . 268 parts In-Stock

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268

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Overview

Experience exceptional performance and reliability with the TLV1504IDG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters for a wide range of applications. With 10-bit resolution and a maximum linearity error of just 0.0488%, this product offers unparalleled accuracy. The small outline package design makes it perfect for space-constrained environments. Benefit from fast conversion times, low power consumption, and industrial-grade temperature tolerance. Trust Texas Instruments for superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides durability and protection for the internal components, making the product reliable for long-term use.

No. of Analog In Channels: 4

Having 4 analog input channels allows for flexibility in connecting multiple input signals, making the product suitable for various applications.

No. of Bits: 10

With 10 bits of resolution, the product can provide accurate conversion of analog signals into digital format, ensuring precision in data acquisition.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies offers compatibility with a wide range of systems, increasing the versatility of the product.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures up to 85°C ensures reliability in demanding industrial environments.

Sample Rate: 0.2 MHz

The high sample rate of 0.2 MHz allows for fast and accurate conversion of analog signals, making the product suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters TLV1504IDG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.86 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

2.1 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.39 in (9.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP16,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1504IDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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