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TLV1508IPWLE

Texas Instruments

TLV1508IPWLE by Texas Instruments

TLV1508IPWLE by Texas Instruments is a 10-bit ADC with 8 analog in channels, 0.0488% max linearity error, and 0.2 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion within -40 to 85°C range. Package: PLASTIC/EPOXY, Surface Mount, Small Outline, Thin Profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,847 parts In-Stock

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5,847

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Digiode

USA . 2,259 parts In-Stock

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2,259

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,644 parts In-Stock

1+ parts

$3.000

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1,644

$3.000

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AZTECH Wire

Italy . 700 parts In-Stock

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$10.107

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700

$10.107

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Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

$19.778

100+ parts

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$19.744

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2,067

$19.778

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$19.744

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DigiPath Technology Company

USA . 1,778 parts In-Stock

1+ parts

$21.779

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1,778

$21.779

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ChromeModa Solutions

Germany . 4,123 parts In-Stock

1+ parts

$22.223

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$18.223

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4,123

$22.223

$18.223

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IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$22.223

100+ parts

$21.112

1k+ parts

$20.001

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101

$22.223

$21.112

$20.001

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Corphita

USA . 2,772 parts In-Stock

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2,772

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Overview

Elevate your analog-to-digital conversion experience with the TLV1508IPWLE by Texas Instruments. Crafted with precision and expertise, this ADC boasts unparalleled quality and reliability, making it the top choice for a wide range of applications. From industrial automation to consumer electronics, this converter excels in delivering accurate results with lightning-fast speed. Experience the value and benefits of seamless integration, precise data acquisition, and superior performance that only Texas Instruments can offer. Choose the TLV1508IPWLE for a transformative digital experience like never before.

Feature Benefit Bullets

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile input options and increased flexibility in data acquisition.

No. of Bits: 10

A higher number of bits (10 in this case) results in greater resolution and accuracy in the conversion process, making this product suitable for high-precision applications.

Maximum Linearity Error (EL): 0.0488%

With a very low maximum linearity error percentage, this product ensures that the converted digital output closely matches the original analog input signal, enhancing data accuracy.

Maximum Conversion Time: 3.6 us

The fast conversion time of 3.6 microseconds enables quick and efficient data processing, making this product suitable for applications requiring real-time data acquisition.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various operating environments.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 volts ensures compatibility with standard power sources, making integration into existing systems seamless.

Technical Specifications

Analog-to-Digital Converters TLV1508IPWLE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.6 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

Trade Compliance

TLV1508IPWLE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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