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TLV1570CPWR

Texas Instruments

TLV1570CPWR by Texas Instruments

TLV1570CPWR by Texas Instruments is a 10-bit ADC with 8 analog in channels, operating at 1.25 MHz sample rate. It has a max linearity error of 0.0977% and operates on power supplies of 3/5 V. Ideal for applications requiring precise analog-to-digital conversion in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,909 parts In-Stock

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Digiode

USA . 3,626 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 1,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 735 parts In-Stock

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735

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AZTECH Wire

Italy . 222 parts In-Stock

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$7.006

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222

$7.006

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Parana Technologies

USA . 621 parts In-Stock

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$10.296

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$10.823

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621

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One Stop Electronics

USA . 469 parts In-Stock

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$11.000

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DigiPath Technology Company

USA . 796 parts In-Stock

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$11.338

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$10.431

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IDEA Electronic Components Group

UK . 1,413 parts In-Stock

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$11.569

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$10.991

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$10.412

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ChromeModa Solutions

Germany . 751 parts In-Stock

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$11.569

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$9.487

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Microchip USA

USA . 2,482 parts In-Stock

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$104.740

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$102.920

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$102.010

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$101.100

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Lixinc

USA . 10,882 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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Perfect Parts

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Corphita

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the TLV1570CPWR by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers a cutting-edge solution for your data acquisition needs. This versatile ADC boasts 8 analog input channels and a rapid sample rate of 1.25 MHz, ensuring precise and efficient conversions. Whether you're in industrial automation, medical instrumentation, or consumer electronics, the TLV1570CPWR offers unparalleled value and performance that will elevate your designs to new heights. Choose Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for electronic components.

No. of Analog In Channels: 8

Allows for multiple inputs to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Standard shape for easy integration into various systems.

No. of Bits: 10

High resolution for accurate digital conversion of analog signals.

Maximum Linearity Error (EL): 0.0977 %

Low error rate ensures accurate conversion and reliable performance.

Power Supplies (V): 3/5

Flexible power supply options for compatibility with different systems.

No. of Terminals: 20

Sufficient terminals for connectivity and integration with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design for space-constrained applications.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for versatility in different environments.

Minimum Operating Temperature: 0 °C

Can function in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable finish for reliable connections and long-term use.

Terminal Position: DUAL

Provides flexibility in mounting and connectivity options.

Maximum Conversion Time: 1 us

Fast conversion time for real-time applications.

Maximum Seated Height: 1.2 mm

Low profile design for compact systems.

Width: 4.4 mm

Small width for space-saving integration.

Maximum Time At Peak Reflow Temperature (s): 30

Resistant to high temperatures during assembly process.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for reliable soldering.

Length: 6.5 mm

Compact length for space-constrained applications.

Temperature Grade: COMMERCIAL

Suitable for commercial applications.

Maximum Analog Input Voltage: 5.5 V

Wide input voltage range for compatibility with various signals.

Sample Rate: 1.25 MHz

High sample rate for capturing fast-changing signals accurately.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connections.

Maximum Supply Current: 8.5 mA

Low supply current for energy-efficient operation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC for high accuracy and efficiency.

Nominal Supply Voltage: 3 V

Standard voltage for compatibility with many systems.

Output Bit Code: BINARY

Binary output for easy processing and analysis.

Terminal Pitch: 0.65 mm

Small terminal pitch for compact layout and space-saving design.

Minimum Analog Input Voltage: 0 V

Accepts zero voltage input signals for versatile use.

Output Format: SERIAL

Serial output format for easy data transmission.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold feature for accurate signal capture and conversion.

Technical Specifications

Analog-to-Digital Converters TLV1570CPWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

1.25 MHz

Hold Mode:

Sample

Maximum Conversion Time:

1 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

8.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1570CPWR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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