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TLV0838IDWG4

Texas Instruments

TLV0838IDWG4 by Texas Instruments

TLV0838IDWG4 by Texas Instruments is an 8-channel ADC with 8-bit resolution, 0.0977% linearity error, and 32us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact SMD package.

Median Price

$8.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$8.300

1k+ parts

$7.430

10k+ parts

$6.990

23

-

$8.300

$7.430

$6.990

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,553 parts In-Stock

1+ parts

$4.094

100+ parts

-

1k+ parts

-

10k+ parts

-

3,553

$4.094

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-

-

Vyrian

USA . 3,916 parts In-Stock

1+ parts

-

100+ parts

-

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3,916

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Euro-Tech

UK . 20 parts In-Stock

1+ parts

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 454 parts In-Stock

1+ parts

$3.879

100+ parts

-

1k+ parts

-

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454

$3.879

-

-

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AZTECH Wire

Italy . 210 parts In-Stock

1+ parts

$16.030

100+ parts

-

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210

$16.030

-

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$16.491

100+ parts

$15.007

1k+ parts

$13.523

10k+ parts

-

200

$16.491

$15.007

$13.523

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Parana Technologies

USA . 2,332 parts In-Stock

1+ parts

$18.691

100+ parts

$1,735.733

1k+ parts

$16.822

10k+ parts

-

2,332

$18.691

$1,735.733

$16.822

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DigiPath Technology Company

USA . 1,064 parts In-Stock

1+ parts

$20.581

100+ parts

-

1k+ parts

-

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1,064

$20.581

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ChromeModa Solutions

Germany . 1,588 parts In-Stock

1+ parts

$21.001

100+ parts

$17.221

1k+ parts

-

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1,588

$21.001

$17.221

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IDEA Electronic Components Group

UK . 492 parts In-Stock

1+ parts

$21.001

100+ parts

$19.951

1k+ parts

$18.901

10k+ parts

-

492

$21.001

$19.951

$18.901

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Microchip USA

USA . 1,172 parts In-Stock

1+ parts

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1,172

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Overview

Experience superior performance and precision with the TLV0838IDWG4 Analog-to-Digital Converter from Texas Instruments. This innovative product boasts unmatched quality and reliability, making it the ideal choice for a wide range of applications. With 8 analog input channels and a compact package shape, this converter delivers exceptional value and efficiency. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the TLV0838IDWG4 and unlock endless possibilities in the world of analog-to-digital conversion.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile input options and flexibility in data acquisition.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into compact electronic designs.

No. of Bits: 8

The 8-bit resolution provides sufficient accuracy for many standard applications.

Maximum Linearity Error (EL): 0.0977 %

The low maximum linearity error ensures accurate and reliable conversion of analog signals to digital data.

Power Supplies (V): 3.3

Operating at a standard 3.3V supply voltage makes the product compatible with typical electronic systems.

No. of Terminals: 20

Having 20 terminals allows for easy connectivity and signal routing in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density circuit board layouts.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement enables operation in low-power environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Temperature Grade: INDUSTRIAL

Being industrial-grade ensures the product meets quality and reliability standards for industrial applications.

Output Bit Code: BINARY

Outputting data in binary format simplifies data processing and interfacing with digital systems.

Technical Specifications

Analog-to-Digital Converters TLV0838IDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.65 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

750 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0838IDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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