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TLV0831CDRG4

Texas Instruments

TLV0831CDRG4 by Texas Instruments

TLV0831CDRG4 by Texas Instruments is an 8-bit ADC with 0.0977% linearity error, 32us conversion time, and 3.65V max analog input voltage. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,285 parts In-Stock

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8,285

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Digiode

USA . 272 parts In-Stock

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272

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Distributors (Availability)

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One Stop Electronics

USA . 458 parts In-Stock

1+ parts

$19.000

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458

$19.000

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AZTECH Wire

Italy . 367 parts In-Stock

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$19.165

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367

$19.165

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Parana Technologies

USA . 1,163 parts In-Stock

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$21.761

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$22.220

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1,163

$21.761

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$22.220

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DigiPath Technology Company

USA . 1,721 parts In-Stock

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$23.962

100+ parts

$22.045

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1,721

$23.962

$22.045

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ChromeModa Solutions

Germany . 4,444 parts In-Stock

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$24.451

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$20.050

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4,444

$24.451

$20.050

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IDEA Electronic Components Group

UK . 913 parts In-Stock

1+ parts

$24.451

100+ parts

$23.228

1k+ parts

$22.006

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913

$24.451

$23.228

$22.006

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A-Z Elektronik GmbH

Germany . 6,339 parts In-Stock

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Corphita

USA . 1,687 parts In-Stock

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Overview

Discover the innovative TLV0831CDRG4 Analog-to-Digital Converter by Texas Instruments, a leading manufacturer known for high-quality products. This versatile device offers precision and reliability in converting analog signals to digital, making it ideal for a wide range of applications. With its compact design and advanced technology, this converter provides exceptional value and performance for customers looking for accuracy and efficiency in their systems. Experience the benefits of seamless integration and superior functionality with the TLV0831CDRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a durable and lightweight package for the converter, making it suitable for various applications.

No. of Bits: 8

With 8 bits resolution, this converter offers a good balance between precision and speed, suitable for many general-purpose applications.

Maximum Linearity Error (EL): 0.0977 %

The low linearity error ensures accurate conversion of analog signals to digital format, making this converter reliable for critical measurements.

Maximum Conversion Time: 32 us

The fast conversion time allows for real-time processing of analog signals, making this converter ideal for applications that require quick response.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter energy-efficient and reliable in noisy environments.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type provides a good trade-off between speed and accuracy, making this converter suitable for a wide range of applications.

Technical Specifications

Analog-to-Digital Converters TLV0831CDRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.65 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0831CDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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