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TLV0831ID

Texas Instruments

TLV0831ID by Texas Instruments

TLV0831ID by Texas Instruments is an 8-bit ADC with 0.0977% linearity error, 32us conversion time, and 0.031MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

$10.958

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 112 parts In-Stock

1+ parts

$17.530

100+ parts

$10.460

1k+ parts

$9.760

10k+ parts

-

112

$17.530

$10.460

$9.760

-

Rochester

USA . 16,759 parts In-Stock

1+ parts

-

100+ parts

$8.540

1k+ parts

$7.640

10k+ parts

$7.190

16,759

-

$8.540

$7.640

$7.190

DigiKey

USA . 16,759 parts In-Stock

1+ parts

-

100+ parts

$11.240

1k+ parts

-

10k+ parts

-

16,759

-

$11.240

-

-

Verical

USA . 4,559 parts In-Stock

1+ parts

-

100+ parts

$10.675

1k+ parts

$9.550

10k+ parts

$8.988

4,559

-

$10.675

$9.550

$8.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,016 parts In-Stock

1+ parts

$4.503

100+ parts

-

1k+ parts

-

10k+ parts

-

1,016

$4.503

-

-

-

Vyrian

USA . 3,551 parts In-Stock

1+ parts

$4.740

100+ parts

-

1k+ parts

-

10k+ parts

-

3,551

$4.740

-

-

-

Prism Electronics

USA . 137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

137

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,696 parts In-Stock

1+ parts

$4.030

100+ parts

-

1k+ parts

-

10k+ parts

-

10,696

$4.030

-

-

-

Component Stockers USA

USA . 24,962 parts In-Stock

1+ parts

$4.250

100+ parts

$3.990

1k+ parts

$3.200

10k+ parts

$3.200

24,962

$4.250

$3.990

$3.200

$3.200

Corphita

USA . 3,889 parts In-Stock

1+ parts

$4.266

100+ parts

-

1k+ parts

-

10k+ parts

-

3,889

$4.266

-

-

-

Parana Technologies

USA . 930 parts In-Stock

1+ parts

$7.132

100+ parts

-

1k+ parts

$7.646

10k+ parts

-

930

$7.132

-

$7.646

-

DigiPath Technology Company

USA . 1,023 parts In-Stock

1+ parts

$7.854

100+ parts

$7.225

1k+ parts

-

10k+ parts

-

1,023

$7.854

$7.225

-

-

ChromeModa Solutions

Germany . 4,867 parts In-Stock

1+ parts

$8.014

100+ parts

$6.571

1k+ parts

-

10k+ parts

-

4,867

$8.014

$6.571

-

-

IDEA Electronic Components Group

UK . 705 parts In-Stock

1+ parts

$8.014

100+ parts

-

1k+ parts

$7.213

10k+ parts

-

705

$8.014

-

$7.213

-

Microchip USA

USA . 3,025 parts In-Stock

1+ parts

$27.950

100+ parts

$27.780

1k+ parts

$27.690

10k+ parts

$27.610

3,025

$27.950

$27.780

$27.690

$27.610

Kepictronics

USA . 3,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,240

-

-

-

-

Assy Fe

Spain . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Overview

Experience high-quality analog-to-digital conversion with the TLV0831ID by Texas Instruments. Designed with precision and reliability in mind, this converter offers fast conversion times and low linearity errors. Ideal for industrial applications, this small outline package is easy to integrate into your designs. Transform analog signals into digital data effortlessly with the TLV0831ID, providing value and efficiency to your projects. Trust in Texas Instruments for top-notch performance and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and durability for the Analog-to-Digital Converter, making it suitable for various environmental conditions.

No. of Bits: 8

8-bit resolution provides sufficient accuracy for many applications while keeping the cost of the ADC competitive.

Power Supplies (V): 3.3

Operating at 3.3V allows compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this ADC can withstand harsh industrial environments without performance degradation.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the ADC reliable and energy-efficient.

Output Format: SERIAL

Serial output format allows for easy integration with microcontrollers and other digital devices, simplifying the overall system design.

Technical Specifications

Analog-to-Digital Converters TLV0831ID attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0831ID Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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