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TLV0832CDRG4

Texas Instruments

TLV0832CDRG4 by Texas Instruments

TLV0832CDRG4 by Texas Instruments is an 8-bit ADC with 2 analog input channels, operating at 3.3V. It offers a max linearity error of 0.0977%, suitable for commercial applications requiring precise analog-to-digital conversion in a compact small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,264 parts In-Stock

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Digiode

USA . 3,521 parts In-Stock

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3,521

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Distributors (Availability)

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AZTECH Wire

Italy . 808 parts In-Stock

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$5.891

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808

$5.891

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Parana Technologies

USA . 2,268 parts In-Stock

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$13.604

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$14.103

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$13.604

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$14.103

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ChromeModa Solutions

Germany . 4,111 parts In-Stock

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$15.285

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$12.534

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4,111

$15.285

$12.534

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IDEA Electronic Components Group

UK . 1,574 parts In-Stock

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$15.285

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$14.521

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$13.756

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1,574

$15.285

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$13.756

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One Stop Electronics

USA . 650 parts In-Stock

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$38.000

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650

$38.000

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Component Stockers USA

USA . 409 parts In-Stock

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$99.990

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409

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Corphita

USA . 4,943 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,572 parts In-Stock

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DigiPath Technology Company

USA . 1,951 parts In-Stock

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$13.781

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Microchip USA

USA . 1,119 parts In-Stock

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Kepictronics

USA . 320 parts In-Stock

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Overview

Discover the cutting-edge TLV0832CDRG4 Analog-to-Digital Converter by Texas Instruments, renowned for its superior quality and precision. Ideal for a wide range of applications, this innovative product offers customers unrivaled value and benefits. With its high performance and reliability, this converter ensures accurate and efficient data conversion, making it the perfect choice for your next project. Experience the difference with Texas Instruments and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and ensures long-term reliability.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting and converting multiple analog signals simultaneously.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

No. of Bits: 8

The 8-bit resolution provides decent accuracy for converting analog signals into digital data.

Maximum Linearity Error (EL): 0.0977 %

The low linearity error ensures accurate conversion of analog signals with minimal distortion.

Power Supplies (V): 3.3

Operating at 3.3V makes this product compatible with standard power sources, offering ease of use.

No. of Terminals: 8

Having 8 terminals simplifies the connectivity and integration of the product within a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact designs.

Minimum Supply Voltage: 2.7 V

Operating at a minimum voltage of 2.7V allows for compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can perform reliably in various environments.

Technical Specifications

Analog-to-Digital Converters TLV0832CDRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.65 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0832CDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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