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TLV0831CDG4

Texas Instruments

TLV0831CDG4 by Texas Instruments

TLV0831CDG4 by Texas Instruments is an 8-bit ADC with 0.0977% linearity error, 32us conversion time, and 3.65V max analog input voltage. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,989 parts In-Stock

1+ parts

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3,989

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Digiode

USA . 2,048 parts In-Stock

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2,048

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$7.339

100+ parts

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591

$7.339

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Parana Technologies

USA . 1,671 parts In-Stock

1+ parts

$13.960

100+ parts

$1,296.365

1k+ parts

$12.564

10k+ parts

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1,671

$13.960

$1,296.365

$12.564

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DigiPath Technology Company

USA . 1,122 parts In-Stock

1+ parts

$15.371

100+ parts

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1,122

$15.371

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ChromeModa Solutions

Germany . 3,774 parts In-Stock

1+ parts

$15.685

100+ parts

$12.862

1k+ parts

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3,774

$15.685

$12.862

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IDEA Electronic Components Group

UK . 1,795 parts In-Stock

1+ parts

$15.685

100+ parts

$14.901

1k+ parts

$14.116

10k+ parts

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1,795

$15.685

$14.901

$14.116

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One Stop Electronics

USA . 1,563 parts In-Stock

1+ parts

$23.000

100+ parts

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1,563

$23.000

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Corphita

USA . 326 parts In-Stock

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326

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Overview

Discover the TLV0831CDG4 by Texas Instruments, a top-of-the-line Analog-to-Digital Converter that delivers unparalleled precision and reliability. As a renowned manufacturer in the industry, Texas Instruments ensures cutting-edge technology and exceptional quality in every product. Ideal for a wide range of applications, this ADC offers fast conversion times and low linearity errors, making it a valuable asset for your projects. Experience the benefits of seamless integration, superior performance, and unmatched value with the TLV0831CDG4 – the perfect solution for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the converter, ensuring long-term reliability.

No. of Bits: 8

The 8-bit resolution allows for a wide range of digital values to represent the analog input signal, providing accurate conversion.

Power Supplies (V): 3.3

The low power supply voltage of 3.3V allows for efficient operation and reduced power consumption.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter ideal for precision analog-to-digital conversion.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type provides accurate conversion results with a fast conversion time of 32 us.

Technical Specifications

Analog-to-Digital Converters TLV0831CDG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.65 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0831CDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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