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TLV0831IDR

Texas Instruments

TLV0831IDR by Texas Instruments

TLV0831IDR by Texas Instruments is an 8-bit ADC with 0.0977% EL, 3.3V supplies, and 0.031 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact SMD package.

Median Price

$8.900

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

$7.120

1k+ parts

$6.370

10k+ parts

$5.990

20,000

-

$7.120

$6.370

$5.990

DigiKey

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

$9.360

1k+ parts

-

10k+ parts

-

20,000

-

$9.360

-

-

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$8.900

1k+ parts

$7.963

10k+ parts

$7.487

15,000

-

$8.900

$7.963

$7.487

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,860 parts In-Stock

1+ parts

$3.752

100+ parts

-

1k+ parts

-

10k+ parts

-

1,860

$3.752

-

-

-

Vyrian

USA . 1,717 parts In-Stock

1+ parts

$3.950

100+ parts

-

1k+ parts

-

10k+ parts

-

1,717

$3.950

-

-

-

Bristol Electronics

USA . 699 parts In-Stock

1+ parts

$7.875

100+ parts

$4.725

1k+ parts

$4.528

10k+ parts

-

699

$7.875

$4.725

$4.528

-

DigiKey Marketplace

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Cyclops Electronics Ltd

UK . 1,571 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,571

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

780

-

-

-

-

Dan-Mar Components

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

780

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,835 parts In-Stock

1+ parts

$3.555

100+ parts

-

1k+ parts

-

10k+ parts

-

1,835

$3.555

-

-

-

Microchip USA

USA . 2,976 parts In-Stock

1+ parts

$21.610

100+ parts

$21.480

1k+ parts

$21.410

10k+ parts

$21.340

2,976

$21.610

$21.480

$21.410

$21.340

Parana Technologies

USA . 735 parts In-Stock

1+ parts

$22.715

100+ parts

-

1k+ parts

$23.380

10k+ parts

-

735

$22.715

-

$23.380

-

DigiPath Technology Company

USA . 2,042 parts In-Stock

1+ parts

$25.012

100+ parts

-

1k+ parts

-

10k+ parts

-

2,042

$25.012

-

-

-

ChromeModa Solutions

Germany . 3,455 parts In-Stock

1+ parts

$25.522

100+ parts

$20.928

1k+ parts

-

10k+ parts

-

3,455

$25.522

$20.928

-

-

IDEA Electronic Components Group

UK . 1,893 parts In-Stock

1+ parts

$25.522

100+ parts

$24.246

1k+ parts

$22.970

10k+ parts

-

1,893

$25.522

$24.246

$22.970

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$27.106

100+ parts

$24.666

1k+ parts

$22.227

10k+ parts

-

2,000

$27.106

$24.666

$22.227

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,424

-

-

-

-

Metaverse IC Inc.

Canada . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

-

-

-

-

Kepictronics

USA . 196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

196

-

-

-

-

Overview

The TLV0831IDR by Texas Instruments is a top-quality Analog-to-Digital Converter that offers precision and reliability for your electronic projects. With Texas Instruments' trusted reputation for excellence in manufacturing, you can trust that this ADC will deliver accurate results every time. Ideal for applications requiring fast and efficient conversion, the TLV0831IDR provides value by enhancing performance and reducing errors in your designs. Upgrade your projects with the TLV0831IDR and experience the benefits of superior quality and advanced technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the analog-to-digital converter, ensuring a long lifespan.

No. of Bits: 8

Having 8 bits allows for a higher resolution in converting analog signals to digital, providing more accurate results.

Power Supplies (V): 3.3

The 3.3V power supply ensures the analog-to-digital converter operates efficiently and reliably.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can perform reliably in various industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter efficient and reliable.

Technical Specifications

Analog-to-Digital Converters TLV0831IDR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0831IDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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