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TLV0832ID

Texas Instruments

TLV0832ID by Texas Instruments

TLV0832ID by Texas Instruments is an 8-bit ADC with 2 analog in channels, 0.0977% EL, and 32us conversion time. Ideal for industrial applications requiring small outline package style and CMOS technology.

Median Price

$9.407

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$17.050

100+ parts

$9.680

1k+ parts

$9.450

10k+ parts

-

160

$17.050

$9.680

$9.450

-

Rochester

USA . 24,303 parts In-Stock

1+ parts

-

100+ parts

$8.300

1k+ parts

$7.430

10k+ parts

$6.990

24,303

-

$8.300

$7.430

$6.990

DigiKey

USA . 24,303 parts In-Stock

1+ parts

-

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$10.930

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24,303

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$10.930

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Verical

USA . 16,099 parts In-Stock

1+ parts

-

100+ parts

$10.375

1k+ parts

$9.287

10k+ parts

$8.738

16,099

-

$10.375

$9.287

$8.738

Arrow

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$8.439

1k+ parts

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150

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$8.439

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Chip1Stop

Japan . 75 parts In-Stock

1+ parts

-

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$3.159

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75

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$3.159

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Distributors (In-Stock)

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Vyrian

USA . 494 parts In-Stock

1+ parts

$3.159

100+ parts

-

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494

$3.159

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-

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Digiode

USA . 930 parts In-Stock

1+ parts

$4.380

100+ parts

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930

$4.380

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DigiKey Marketplace

USA . 24,528 parts In-Stock

1+ parts

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24,528

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ComSIT Distribution GmbH

Germany . 132 parts In-Stock

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132

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Sea View Technologies

USA . 71 parts In-Stock

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71

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Bristol Electronics

USA . 71 parts In-Stock

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71

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Semtec, LLC

USA . 31 parts In-Stock

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J & M Industries LLC

USA . 30 parts In-Stock

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Lantek

USA . 19 parts In-Stock

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Ashlea Components Ltd

UK . 12 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 17,670 parts In-Stock

1+ parts

$3.230

100+ parts

$3.040

1k+ parts

$2.440

10k+ parts

$2.750

17,670

$3.230

$3.040

$2.440

$2.750

Corphita

USA . 2,122 parts In-Stock

1+ parts

$4.149

100+ parts

-

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2,122

$4.149

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Microchip USA

USA . 1,728 parts In-Stock

1+ parts

$21.580

100+ parts

$21.450

1k+ parts

$21.380

10k+ parts

$21.310

1,728

$21.580

$21.450

$21.380

$21.310

Parana Technologies

USA . 1,631 parts In-Stock

1+ parts

$22.290

100+ parts

-

1k+ parts

$22.964

10k+ parts

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1,631

$22.290

-

$22.964

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DigiPath Technology Company

USA . 400 parts In-Stock

1+ parts

$24.544

100+ parts

$22.581

1k+ parts

-

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400

$24.544

$22.581

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IDEA Electronic Components Group

UK . 1,690 parts In-Stock

1+ parts

$25.045

100+ parts

$23.793

1k+ parts

$22.540

10k+ parts

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1,690

$25.045

$23.793

$22.540

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ChromeModa Solutions

Germany . 675 parts In-Stock

1+ parts

$25.045

100+ parts

$20.537

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675

$25.045

$20.537

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Perfect Parts

USA . 691 parts In-Stock

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691

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 31 parts In-Stock

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31

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Overview

Unlock precision and reliability with the TLV0832ID by Texas Instruments. As a leader in Analog-to-Digital Converters, Texas Instruments delivers top-quality products for a wide range of applications. With 8 bits of accuracy and a maximum linearity error of 0.0977%, this converter offers unmatched performance. Its compact design and low power consumption make it perfect for industrial settings. Trust Texas Instruments to provide the tools you need for seamless data acquisition and analysis. Elevate your projects today with the TLV0832ID.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making it ideal for a variety of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatility and the ability to measure multiple signals simultaneously.

Surface Mount: YES

Surface mount packaging simplifies the PCB assembly process and saves space, making it suitable for compact designs.

No. of Bits: 8

8-bit resolution provides sufficient accuracy for many general-purpose applications while keeping costs low.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V allows for compatibility with a wide range of electronic systems and power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this ADC can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems.

Sample Rate: 0.031 MHz

The 0.031 MHz sample rate ensures accurate conversion of analog signals into digital data at a reasonable speed.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC method provides high accuracy with a relatively simple circuit design.

Output Format: SERIAL

Having a serial output format allows for straightforward interfacing with microcontrollers and other digital devices.

Technical Specifications

Analog-to-Digital Converters TLV0832ID attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0832ID Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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