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TLV0832IDR

Texas Instruments

TLV0832IDR by Texas Instruments

TLV0832IDR by Texas Instruments is an 8-bit ADC with 2 analog in channels, operating at a sample rate of 0.031 MHz. It has a max linearity error of 0.0977% and operates on a power supply of 3.3V. Ideal for industrial applications requiring precise analog-to-digital conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,842 parts In-Stock

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Digiode

USA . 459 parts In-Stock

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459

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Distributors (Availability)

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AZTECH Wire

Italy . 609 parts In-Stock

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$11.230

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609

$11.230

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Parana Technologies

USA . 1,940 parts In-Stock

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$14.258

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$14.710

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1,940

$14.258

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$14.710

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ChromeModa Solutions

Germany . 6,188 parts In-Stock

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$16.020

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$13.136

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$16.020

$13.136

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IDEA Electronic Components Group

UK . 1,357 parts In-Stock

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$16.020

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$15.219

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$14.418

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1,357

$16.020

$15.219

$14.418

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Microchip USA

USA . 1,674 parts In-Stock

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$16.850

100+ parts

$16.750

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$16.700

10k+ parts

$16.640

1,674

$16.850

$16.750

$16.700

$16.640

One Stop Electronics

USA . 832 parts In-Stock

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$23.000

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832

$23.000

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A-Z Elektronik GmbH

Germany . 11,469 parts In-Stock

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Lixinc

USA . 6,342 parts In-Stock

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Kepictronics

USA . 3,516 parts In-Stock

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Corphita

USA . 2,898 parts In-Stock

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DigiPath Technology Company

USA . 984 parts In-Stock

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$14.444

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984

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$14.444

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Overview

Unlock the power of precision with the TLV0832IDR by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers top-quality products that exceed industry standards. Perfect for applications requiring accurate data conversion, this small outline package offers dual terminals and a binary output format. With a quick conversion time and industrial temperature grade, the TLV0832IDR provides unbeatable value and reliability. Upgrade your project with Texas Instruments, where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the converter, ensuring a longer lifespan.

No. of Analog In Channels: 2

Having multiple analog input channels allows for versatile input options, making this converter suitable for a variety of applications.

Surface Mount: YES

Surface mount capability makes installation and integration of the converter easier and more convenient.

No. of Bits: 8

The 8-bit resolution provides sufficient accuracy for many applications while keeping the cost of the converter competitive.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with common power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can withstand harsh environments and temperature variations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall performance and reliability of the converter.

Output Format: SERIAL

Serial output format allows for easy data transmission and integration with digital systems, simplifying the overall design and operation.

Technical Specifications

Analog-to-Digital Converters TLV0832IDR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0832IDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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